发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US09707850申请日: 2000-11-08
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公开(公告)号: US06333212B1公开(公告)日: 2001-12-25
- 发明人: Jun Ohmori , Hiroshi Iwasaki , Takuya Takahashi , Takanori Jin , Masatoshi Fukuda
- 申请人: Jun Ohmori , Hiroshi Iwasaki , Takuya Takahashi , Takanori Jin , Masatoshi Fukuda
- 优先权: JP7-217277 19950825
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.