- 专利标题： Semiconductor flip-chip package and method for the fabrication thereof
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申请号： US09517839申请日： 2000-03-02
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公开(公告)号： US06335571B1公开(公告)日： 2002-01-01
- 发明人: Miguel Albert Capote , Xiaoqi Zhu , Robert Vinson Burress , Yong-Joon Lee
- 申请人： Miguel Albert Capote , Xiaoqi Zhu , Robert Vinson Burress , Yong-Joon Lee
- 主分类号： H01L2328
- IPC分类号： H01L2328
摘要：
A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.