公开(公告)号：US06399426B1

公开(公告)日：2002-06-04

申请号：US09948921

申请日：2001-09-07

申请人： Miguel Albert Capote ,  Xiaoqi Zhu ,  Robert Vinson Burress ,  Yong-Joon Lee

发明人： Miguel Albert Capote ,  Xiaoqi Zhu ,  Robert Vinson Burress ,  Yong-Joon Lee

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.

摘要翻译： 倒装芯片器件和用于制造该器件的工艺采用多层密封剂，其包括热膨胀系数至多为30ppm /℃的第一部分密封剂和2-20GPa的弹性模量，第二部分包括 具有可能超过30ppm /℃的热膨胀系数的聚合物助焊剂

公开(公告)号：US06335571B1

公开(公告)日：2002-01-01

申请号：US09517839

申请日：2000-03-02

申请人： Miguel Albert Capote ,  Xiaoqi Zhu ,  Robert Vinson Burress ,  Yong-Joon Lee

发明人： Miguel Albert Capote ,  Xiaoqi Zhu ,  Robert Vinson Burress ,  Yong-Joon Lee

IPC分类号： H01L2328

CPC分类号： C09J4/00 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  H01L21/563 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/20 ,  C08F222/1006 ,  H01L2924/00 ,  H01L2224/0401

摘要： A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.