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1.
公开(公告)号:US06399426B1
公开(公告)日:2002-06-04
申请号:US09948921
申请日:2001-09-07
IPC分类号: H01L2144
CPC分类号: H01L21/563 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/1148 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
摘要翻译: 倒装芯片器件和用于制造该器件的工艺采用多层密封剂,其包括热膨胀系数至多为30ppm /℃的第一部分密封剂和2-20GPa的弹性模量,第二部分包括 具有可能超过30ppm /℃的热膨胀系数的聚合物助焊剂
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公开(公告)号:US06335571B1
公开(公告)日:2002-01-01
申请号:US09517839
申请日:2000-03-02
IPC分类号: H01L2328
CPC分类号: C09J4/00 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , H01L21/563 , H01L23/49883 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/1148 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/838 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/20 , C08F222/1006 , H01L2924/00 , H01L2224/0401
摘要: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
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公开(公告)号:US06518677B1
公开(公告)日:2003-02-11
申请号:US09662641
申请日:2000-09-15
申请人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号: H01L2348
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
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4.
公开(公告)号:US06297560B1
公开(公告)日:2001-10-02
申请号:US09137971
申请日:1998-08-21
申请人: Miguel A. Capote , Xiaoqi Zhu
发明人: Miguel A. Capote , Xiaoqi Zhu
IPC分类号: H01L2348
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.
摘要翻译: 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程,以消除常规毛细管流动底部填充过程。 还提供了一种倒装芯片配置,其具有用于底部填充封装的柔性带层压。 通过这种配置,投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变,并提供增强的耐用性。
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公开(公告)号:US6121689A
公开(公告)日:2000-09-19
申请号:US120172
申请日:1998-07-21
申请人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号: B23K35/02 , B23K35/36 , B32B7/12 , C09J4/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/433 , H01L23/48 , H01L23/498 , H05K1/09 , H05K3/32 , H01L23/52 , H01L29/40
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
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6.
公开(公告)号:US20050218517A1
公开(公告)日:2005-10-06
申请号:US10855708
申请日:2004-05-28
申请人: Miguel Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人: Miguel Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号: B23K35/02 , B23K35/36 , B32B7/12 , C09J4/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/433 , H01L23/48 , H01L23/498 , H05K1/09 , H05K3/32
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
摘要翻译: 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程,以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工,测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面,将芯片和预包封的密封剂与衬底成角度地放置并与预涂敷的衬底接触,然后将芯片和预涂封装体围绕第一接触点枢转,排出其间的任何气体直到 芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置,其具有投诉焊料/柔性密封剂底部结构,当衬底经历膨胀或收缩时,其基本上横向变形。 通过这种配置,投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变,而不会使芯片和基板弯曲。
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7.
公开(公告)号:US06774493B2
公开(公告)日:2004-08-10
申请号:US10390603
申请日:2003-03-19
申请人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号: H01L2348
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
摘要翻译: 通过使用具有分离的分离焊料柱的密封剂底部填充材料预涂芯片来提供芯片与衬底的倒装芯片连接的简化过程,以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工,测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面,将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触,然后将芯片和预包封的密封剂围绕第一接触点枢转,排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置,其具有投诉焊料/柔性密封剂底部结构,当衬底经历膨胀或收缩时,其基本上横向变形。 通过这种配置,投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变,而不会使芯片和基板弯曲。
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公开(公告)号:US06566234B1
公开(公告)日:2003-05-20
申请号:US09662642
申请日:2000-09-15
申请人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人: Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号: H01L2130
CPC分类号: H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
摘要翻译: 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程,以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工,测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面,将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触,然后将芯片和预包封的密封剂围绕第一接触点枢转,排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置,其具有投诉焊料/柔性密封剂底部结构,当衬底经历膨胀或收缩时,其基本上横向变形。 通过这种配置,投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变,而不会使芯片和基板弯曲。
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