发明授权
- 专利标题： Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
- 专利标题（中）： 含铜铝酸铜的铜基糊料用于铜填充通孔的微结构和收缩控制
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申请号： US08466562申请日： 1995-06-06
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公开(公告)号： US06358439B1公开(公告)日： 2002-03-19
- 发明人: Farid Youssif Aoude , Lawrence Daniel David , Renuka Shastri Divakaruni , Shaji Farooq , Lester Wynn Herron , Hal Mitchell Lasky , Anthony Mastreani , Govindarajan Natarajan , Srinivasa S. N. Reddy , Vivek Madan Sura , Rao Venkateswara Vallabhaneni , Donald Rene Wall
- 申请人： Farid Youssif Aoude , Lawrence Daniel David , Renuka Shastri Divakaruni , Shaji Farooq , Lester Wynn Herron , Hal Mitchell Lasky , Anthony Mastreani , Govindarajan Natarajan , Srinivasa S. N. Reddy , Vivek Madan Sura , Rao Venkateswara Vallabhaneni , Donald Rene Wall
- 主分类号： H01B122
- IPC分类号： H01B122
摘要：
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
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