公开(公告)号：US06358439B1

公开(公告)日：2002-03-19

申请号：US08466562

申请日：1995-06-06

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01B122

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678 ,  H01L2924/00

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

摘要翻译： 公开了一种用于在半导体芯片器件的陶瓷衬底封装上填充通孔并形成导电表面图案的铜基膏。 该浆料含有适当粒度和重量比的铝酸铝粉末，以实现烧结产生的通孔和厚膜铜的晶粒尺寸和收缩率控制。 烧结过程中铜材的收缩与陶瓷基体的收缩密切相关。

公开(公告)号：US5925443A

公开(公告)日：1999-07-20

申请号：US758991

申请日：1991-09-10

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：US6124041A

公开(公告)日：2000-09-26

申请号：US266338

申请日：1999-03-11

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.