A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, a top cover and bottom cover of the packaging cover are assembled with a separate frame to secure a coupling between the top and bottom covers of the packaging cover. In one embodiment, the frame includes grooves to receive notches of a module connector coupled to a motherboard. In one embodiment, the frame includes an aperture for receiving connections to thermal solutions external to the packaging cover.