公开(公告)号：US06353538B1

公开(公告)日：2002-03-05

申请号：US09311783

申请日：1999-05-13

申请人： Ihab A. Ali ,  Shawn S. McEuen

发明人： Ihab A. Ali ,  Shawn S. McEuen

IPC分类号： H05K700

CPC分类号： H01L23/3675 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generating varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging cover consists of a plastic material having a sheet of metal coupled to an interior surface of the packaging cover. In one embodiment, the packaging cover includes two separate covers, with a first cover having an insert pin, and a second cover having an insert receptacle to receive the insert pin. In an alternative embodiment, the first cover of the packaging cover includes a set of clip snaps to secure a coupling between the first cover and a second cover of the packaging cover.

摘要翻译： 一种存储器模块，其具有封装封装封装封装的板，该板具有多个单独的芯片，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装盖由具有耦合到包装盖的内表面的金属片的塑料材料组成。 在一个实施例中，包装盖包括两个单独的盖，第一盖具有插入销，第二盖具有用于接收插入销的插入件插座。 在替代实施例中，包装盖的第一盖包括一组夹扣，以固定第一盖和包装盖的第二盖之间的联接。

公开(公告)号：US06188576B1

公开(公告)日：2001-02-13

申请号：US09311658

申请日：1999-05-13

申请人： Ihab A. Ali ,  Shawn S. McEuen

发明人： Ihab A. Ali ,  Shawn S. McEuen

IPC分类号： H05K770

CPC分类号： G11C5/143 ,  G06K19/077

摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging consist of a two separate metal covers. In one embodiment, a first cover of the packaging cover includes a first set of finger wraps and a second cover of the packaging cover includes a second set of finger wraps that interlace with the first set of finger wraps to secure a coupling between the first cover and a second cover of the packaging cover. In an alternative embodiment, a top cover and bottom cover of the packaging are assembled with rivets coupling the top and bottom covers.

摘要翻译： 一种存储器模块，具有用于封装具有多个分离芯片的板的封装盖，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装由两个单独的金属盖组成。 在一个实施例中，包装盖的第一盖包括第一组手指包，并且包装盖的第二盖包括与第一组手指套交织的第二组手指套，以固定第一盖 以及包装盖的第二盖。 在替代实施例中，包装的顶盖和底盖组装有联接顶盖和底盖的铆钉。

公开(公告)号：US06362966B1

公开(公告)日：2002-03-26

申请号：US09311655

申请日：1999-05-13

申请人： Ihab A. Ali ,  Shawn S. McEuen

发明人： Ihab A. Ali ,  Shawn S. McEuen

IPC分类号： H05K700

CPC分类号： G11C5/143 ,  G11C5/00 ,  H05K7/1431

摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, a top cover and bottom cover of the packaging cover are assembled with a separate frame to secure a coupling between the top and bottom covers of the packaging cover. In one embodiment, the frame includes grooves to receive notches of a module connector coupled to a motherboard. In one embodiment, the frame includes an aperture for receiving connections to thermal solutions external to the packaging cover.

摘要翻译： 一种存储器模块，具有用于封装具有多个分离芯片的板的封装盖，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装盖的顶盖和底盖组装有单独的框架，以固定包装盖的顶盖和底盖之间的联接。 在一个实施例中，框架包括凹槽以接收耦合到母板的模块连接器的凹口。 在一个实施例中，框架包括用于接收与包装盖外部的热解决方案的连接的孔。

公开(公告)号：US08695690B2

公开(公告)日：2014-04-15

申请号：US12241010

申请日：2008-09-29

申请人： Ihab A. Ali ,  Frank Liang

发明人： Ihab A. Ali ,  Frank Liang

IPC分类号： H05K7/20 ,  G05D23/00

CPC分类号： G06F1/203 ,  G06F1/1613 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

摘要翻译： 电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。 流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。 电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

公开(公告)号：US20100053885A1

公开(公告)日：2010-03-04

申请号：US12241012

申请日：2008-09-29

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F1/1616 ,  G06F1/1681

摘要： An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.

摘要翻译： 电子设备可以设置有至少部分地包含第一电子部件，第二壳体和联接到第一壳体和第二壳体的铰链组件的第一壳体。 铰链组件可以被配置为将由第一电子部件产生的热量散发离开第一壳体。 在一些实施例中，铰链组件可以被配置为将由第一电子部件产生的热量从第一壳体和第二壳体上散出。 第二壳体可以包括用于在整个第二壳体中从铰链组件散热的散热器。

公开(公告)号：US20080298021A1

公开(公告)日：2008-12-04

申请号：US11809460

申请日：2007-05-31

申请人： Ihab A. Ali ,  Frank F. Liang ,  Amaury Heresztyn

发明人： Ihab A. Ali ,  Frank F. Liang ,  Amaury Heresztyn

IPC分类号： H05K7/20

CPC分类号： H01L23/3732 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.

摘要翻译： 描述设备的实施例。 该装置包括集成电路和耦合到集成电路的散热器。 该散热器包括碳的同素异形体的第一层。 注意，碳的同素异形体具有大致的面心立方晶体结构。 此外，碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

公开(公告)号：US20080291629A1

公开(公告)日：2008-11-27

申请号：US11805501

申请日：2007-05-22

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.

摘要翻译： 描述计算机系统的实施例。 该计算机系统包括耦合到热管的电源，其中电源包括集成电路。 该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。 耦合到热管的泵被配置为使液体冷却剂循环通过热管。 此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

公开(公告)号：US07978474B2

公开(公告)日：2011-07-12

申请号：US11805501

申请日：2007-05-22

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.

摘要翻译： 描述计算机系统的实施例。 该计算机系统包括耦合到热管的电源，其中电源包括集成电路。 该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。 耦合到热管的泵被配置为使液体冷却剂循环通过热管。 此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

公开(公告)号：US07480145B2

公开(公告)日：2009-01-20

申请号：US11591926

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  H05K7/20481 ,  H05K7/20518

摘要： A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

摘要翻译： 系统包括电源和封闭电源的隔热机构。 该热屏蔽机构包括限定电源所在的空腔的三维壳体，以及定位成覆盖由壳体的边缘限定的空腔的开口的板。 注意，壳体包含三层，其中第二层夹在第一层和第三层之间。 该第二层具有第一各向异性热导率。 此外，该板包括具有第二各向异性热导率的材料。

公开(公告)号：US07447033B2

公开(公告)日：2008-11-04

申请号：US11591851

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.

摘要翻译： 便携式计算设备包括具有外表面和内表面的外壳。 计算装置中的固态冷却机构联接到内表面。 该固态冷却机构被配置为保持外表面的至少一部分上的温度差小于预定值。