发明授权
- 专利标题： Method for singling semiconductor components and semiconductor component singling device
- 专利标题（中）： 单晶半导体元件和半导体元件单元设备的方法
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申请号： US09546421申请日： 2000-04-10
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公开(公告)号： US06364751B1公开(公告)日： 2002-04-02
- 发明人: Jens Pohl , Oliver Wutz , Johann Winderl
- 申请人： Jens Pohl , Oliver Wutz , Johann Winderl
- 优先权： DE19916071 19990409
- 主分类号： B28D104
- IPC分类号： B28D104
摘要：
Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.
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