公开(公告)号：US07036216B2

公开(公告)日：2006-05-02

申请号：US10252453

申请日：2002-09-23

申请人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

发明人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

IPC分类号： H05K3/34

CPC分类号： H01L24/80 ,  H01L23/3107 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/53174

摘要： An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.

公开(公告)号：US06521988B2

公开(公告)日：2003-02-18

申请号：US09816929

申请日：2001-03-23

申请人： Christian Hauser ,  Johann Winderl ,  Jens Pohl

发明人： Christian Hauser ,  Johann Winderl ,  Jens Pohl

IPC分类号： H01L2348

CPC分类号： H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/24 ,  H01L2924/01005 ,  H01L2924/01082

摘要： The invention relates to a device and a method for packaging electronic components (11) having semiconductor chips (5) by means of a mounting frame (1), which is additionally provided with a plastic grid (6) that is disposed on a plastic intermediate substrate (2), which surrounds each semiconductor chip (5) in framelike fashion and which for packaging the plurality of semiconductor chips (5) with a plastic casting composition (7) between semiconductor chips (5) and the plastic grid (6).

摘要翻译： 本发明涉及一种用于通过安装框架（1）封装具有半导体芯片（5）的电子部件（11）的装置和方法，该安装框架（1）另外设置有设置在塑料中间件上的塑料格栅（6） 基板（2），其以框架方式围绕每个半导体芯片（5），并且用于在半导体芯片（5）和塑料栅格（6）之间用塑料铸造组合物（7）封装多个半导体芯片（5）。

公开(公告)号：US06486538B1

公开(公告)日：2002-11-26

申请号：US09580984

申请日：2000-05-30

申请人： Martin Reiss ,  Johann Winderl

发明人： Martin Reiss ,  Johann Winderl

IPC分类号： H01L23495

CPC分类号： H01L23/13 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip carrier made of a non-metallic material has conductor tracks applied thereon for producing an external, two-dimensional connection configuration for electronic circuit chips. The chip carrier has a multiplicity of chip mounting locations and first cutouts disposed in such a way that at least one first cutout is adjacent each of the chip mounting locations. A second, channel-like cutout in the chip carrier leads from each chip mounting location to a first cutout adjacent the chip mounting location.

摘要翻译： 由非金属材料制成的芯片载体具有施加在其上的导体轨迹，用于产生用于电子电路芯片的外部二维连接配置。 芯片载体具有多个芯片安装位置和第一切口，其设置成使得至少一个第一切口邻近每个芯片安装位置。 芯片载体中的第二个通道状切口从每个芯片安装位置引导到与芯片安装位置相邻的第一切口。

公开(公告)号：US06429537B2

公开(公告)日：2002-08-06

申请号：US09816931

申请日：2001-03-23

申请人： Christian Hauser ,  Martin Neumayer ,  Johann Winderl ,  Achim Neu ,  Martin Reiss

发明人： Christian Hauser ,  Martin Neumayer ,  Johann Winderl ,  Achim Neu ,  Martin Reiss

IPC分类号： H01L2331

CPC分类号： H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

摘要翻译： 半导体部件包括在其主面上具有接触焊盘的半导体芯片，以及配置在主面上的用于接触焊盘的凹部的布线箔。 箔片在远离主体侧的一侧具有导体轨迹。 导体轨道将接触焊盘连接到焊接触点。 位于凹槽中的接触垫通过导线连接电连接到相邻的导体轨道端。 每个电线连接被第一和第二层的密封化合物包围。 一种制造半导体部件的方法，包括将布线箔施加到芯片的主侧，产生接触焊盘和相邻导体导轨端之间的导线连接，将密封化合物施加到凹部上的位置，以完全覆盖与密封化合物的电线连接 只能固化密封剂的表面。

公开(公告)号：US06894378B2

公开(公告)日：2005-05-17

申请号：US10090289

申请日：2002-03-04

申请人： Johann Winderl

发明人： Johann Winderl

IPC分类号： H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K3/36 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16237 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06575 ,  H05K1/144 ,  H05K3/363 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2203/041

摘要： An electronic component with at least two stacked semiconductor chips is described. The chips are respectively mounted on a wiring board. The wiring boards are stacked one on top of the other and interconnected mechanically and electrically by soldered connections. The soldered connections extend through apertures in the wiring boards and over one or more levels of wiring boards stacked one on top of the other, with semiconductor chips mounted on these boards. A method for producing the electronic component is also described.

摘要翻译： 描述了具有至少两个堆叠的半导体芯片的电子部件。 芯片分别安装在接线板上。 接线板堆叠在另一个之上，并通过焊接连接机械地和电连接。 焊接的连接通过布线板中的孔和超过一层或多层堆叠在另一层上的布线板延伸，半导体芯片安装在这些板上。 还描述了用于制造电子部件的方法。

公开(公告)号：US06614100B1

公开(公告)日：2003-09-02

申请号：US09220745

申请日：1998-12-23

申请人： Christian Hauser ,  Helge Schmidt ,  Johann Winderl

发明人： Christian Hauser ,  Helge Schmidt ,  Johann Winderl

IPC分类号： H05K720

CPC分类号： G06K19/07724 ,  G06K19/07743 ,  G06K19/07745 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

摘要： The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated.

摘要翻译： 引线框架具有弹簧元件，其可以通过注射模具在包装的注射成型期间被压缩。 所得到的弹性具有将引线的接触表面压在注射模具的内壁上的作用。 接触表面抵靠内壁的偏置防止聚合物闪光在接触表面上形成。 此外，弹簧元件在注射操作期间固定引线，并将引线固定在完成的封装中。 因此避免了注射模具内的压紧销。

公开(公告)号：US06534345B1

公开(公告)日：2003-03-18

申请号：US09514265

申请日：2000-02-28

申请人： Simon Muff ,  Jens Pohl ,  Johann Winderl

发明人： Simon Muff ,  Jens Pohl ,  Johann Winderl

IPC分类号： H01L2144

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082

摘要： In order to mount a semiconductor chip on a carrier layer, consolidated filler material is applied between the semiconductor chip and the carrier layer. The filler material is sucked, under the application of a partial vacuum, from at least one edge section of the semiconductor chip to at least one other edge section of the semiconductor chip. As a result, a package is provided in which the filler material is essentially free of air inclusions.

摘要翻译： 为了将半导体芯片安装在载体层上，固化的填充材料被施加在半导体芯片和载体层之间。 填充材料在部分真空下被从半导体芯片的至少一个边缘部分吸收到半导体芯片的至少另一个边缘部分。 结果，提供了其中填充材料基本上不含空气夹杂物的包装。

公开(公告)号：US06364751B1

公开(公告)日：2002-04-02

申请号：US09546421

申请日：2000-04-10

申请人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

发明人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

IPC分类号： B28D104

CPC分类号： H01L21/78 ,  Y10T83/687

摘要： Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.

摘要翻译： 单独地包括安装在公共载体衬底上的至少一个半导体芯片的半导体元件。 分离通过切断载体基底来实现。 因此，载体基板至少在要被切断的载体基板的那个区域中弯曲。 切断从载体基板的凸曲面开始发生。 此外，本发明描述了用于分离半导体部件的单一设备。

公开(公告)号：US07008493B2

公开(公告)日：2006-03-07

申请号：US10685065

申请日：2003-10-14

申请人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

发明人： Johann Winderl ,  Christian Hauser ,  Martin Reiss

IPC分类号： B32B21/60

CPC分类号： H01L24/80 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method is described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.

摘要翻译： 描述了一种将集成电路应用于载体元件的方法。 其中初始糊状稠度的可固化补偿层基本上以完全覆盖涂覆在集成电路的下接触区域上。 于是，集成电路通过补偿层与载体元件在相对对准之后连接在一起，以便通过经过补偿层的厚度的电线产生载体元件的集成电路和导体轨迹之间的电连接 。 于是补偿层被固化，导致补偿层的体积增加。

公开(公告)号：US06891252B2

公开(公告)日：2005-05-10

申请号：US10079114

申请日：2002-02-20

申请人： Johann Winderl ,  Martin Neumayer

发明人： Johann Winderl ,  Martin Neumayer

IPC分类号： H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/3178 ,  H01L23/3185 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/18301 ,  H01L2924/00

摘要： An electronic component includes a semiconductor chip which has an active upper side and a passive rear side. The semiconductor chip is surrounded by a sawn edge. This edge of semiconductor material has profile-sawn contours. The profile-sawn contours are surrounded by a plastics composition forming an edge of plastic. The plastics composition is in form-locking engagement with the profile-sawn contours. A method of producing a component of this type is also provided.

摘要翻译： 电子部件包括具有有源上侧和被动后侧的半导体芯片。 半导体芯片被锯边围绕。 半导体材料的这种边缘具有轮廓锯齿轮廓。 型材锯切轮廓被形成塑料边缘的塑料组合物包围。 塑料组合物与型材锯切轮廓形成锁定接合。 还提供了一种制造这种类型的部件的方法。