发明授权
US06369409B1 Semiconductor device and method of manufacturing the same 失效
半导体装置及其制造方法

  • 专利标题: Semiconductor device and method of manufacturing the same
  • 专利标题(中): 半导体装置及其制造方法
  • 申请号: US08689867
    申请日: 1996-08-15
  • 公开(公告)号: US06369409B1
    公开(公告)日: 2002-04-09
  • 发明人: Hiroaki TakasuJun OsanaiKenji Kitamura
  • 申请人: Hiroaki TakasuJun OsanaiKenji Kitamura
  • 优先权: JP7-215617 19950824; JP7-215618 19950824; JP7-343018 19951228; JP8-068639 19960325; JP8-207302 19960806
  • 主分类号: F02K900
  • IPC分类号: F02K900
Semiconductor device and method of manufacturing the same
摘要:
It is an object to provide a highly precise bleeder resistance circuit having an accurate voltage division ratio and a small temperature coefficient of the resistance value and a highly precise semiconductor device having a small temperature coefficient using such a bleeder resistance circuit, e.g., a semiconductor device such as a voltage detector and a voltage regulator. Such characteristic features that the potential of electric conductors on the thin film resistors and electric conductors under the thin film resistors of a bleeder resistance circuit using thin film resistors is made almost equal to the potential of respective thin film resistors and that, when polysilicon is used in the thin film resistor, the dispersion of the resistance value is controlled and the temperature dependency of the resistance value is made lower by thinning the film thickness of the polysilicon thin film resistor are constituted.
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