A method for monitoring the performance of a material removal tool includes providing a wafer having at least one process layer formed thereon; measuring the thickness of the process layer; removing at least a portion of the process layer in the material removal tool until an endpoint of the removal process is reached; determining a removal rate based on the measured thickness of the process layer and a duration of the removal process until the endpoint is reached; and comparing the determined removal rate to an expected removal rate to monitor the performance of the material removal tool. A processing line includes a metrology tool, a material removal tool, and a process controller. The metrology tool is adapted to measure a thickness of a process layer formed on a wafer. The material removal tool is adapted to remove at least a portion of the process layer until an endpoint is reached. The process controller is adapted to determine a removal rate based on the measured thickness of the process layer and a duration of the removal process until the endpoint is reached and compare the determined removal rate to an expected removal rate to monitor the performance of the material removal tool.