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    Method and apparatus for data stackification for run-to-run control
    1.
    发明授权
    Method and apparatus for data stackification for run-to-run control 有权
    用于运行控制的数据堆叠的方法和装置

    公开(公告)号：US07181354B1

    公开(公告)日：2007-02-20

    申请号：US10227753

    申请日：2002-08-26

    申请人： Christopher A. Bone ,  Anthony J. Toprac

    发明人： Christopher A. Bone ,  Anthony J. Toprac

    IPC分类号： G01N37/00

    CPC分类号： G05B19/41865 ,  G05B2219/32053 ,  G05B2219/37532 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/20

    摘要： A method and an apparatus for organizing production data is provided. The method comprises performing at least one process run of semiconductor devices, and recording at least one manufacturing tag associated with the process run of semiconductor devices. The method further comprises performing metrology upon at least one process run of the semiconductor device for acquiring metrology data and for performing a metrology data stackification process upon the metrology data using the manufacturing tag for organizing and stacking the metrology data. The method further comprises modifying at least one control parameter is modified based upon the stacked metrology data.

    摘要翻译： 提供了一种用于组织生产数据的方法和装置。 该方法包括执行半导体器件的至少一个工艺流程，以及记录与半导体器件的工艺流程相关联的至少一个制造标签。 该方法还包括在用于采集度量数据的半导体器件的至少一个工艺运行中执行度量，并且使用用于组织和堆叠度量数据的制造标签对度量数据进行计量数据叠加处理。 该方法还包括修改至少一个控制参数根据堆叠的度量数据进行修改。

    Method for prioritizing production lots based on grade estimates and output requirements
    2.
    发明授权
    Method for prioritizing production lots based on grade estimates and output requirements 有权
    根据年龄估计和产出要求确定生产批次的方法

    公开(公告)号：US06699727B1

    公开(公告)日：2004-03-02

    申请号：US09821675

    申请日：2001-03-29

    申请人： Anthony J. Toprac ,  Joyce S. Oey Hewett ,  Christopher A. Bode ,  Alexander J. Pasadyn ,  Anastasia Oshelski Peterson ,  Thomas J. Sonderman ,  Michael L. Miller

    发明人： Anthony J. Toprac ,  Joyce S. Oey Hewett ,  Christopher A. Bode ,  Alexander J. Pasadyn ,  Anastasia Oshelski Peterson ,  Thomas J. Sonderman ,  Michael L. Miller

    IPC分类号： G01R3126

    CPC分类号： H01L22/20 ,  G05B19/418 ,  G05B2219/32194 ,  G05B2219/32263 ,  Y02P90/02 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/22

    摘要： A method for prioritizing production flow includes processing a plurality of manufactured items in a process flow; measuring characteristics of a plurality of manufactured items in the process flow; estimating performance grades for the plurality of manufactured items based on the measured characteristics; grouping the manufactured items with like estimated performance grades; assigning priorities to groups of manufactured items with like estimated performance grades; and directing the plurality of manufactured items through the process flow based on the assigned priorities. A manufacturing system includes a plurality of processing tools adapted to process a plurality of manufactured items in a process flow, a metrology tool, and a process control server. The metrology tool is adapted to measure characteristics of a plurality of manufactured items in the process flow. The process control server is adapted to estimate performance grades for the plurality of manufactured items based on the measured characteristics, group the manufactured items with like estimated performance grades, assign priorities to groups of manufactured items with like estimated performance grades, and direct the plurality of manufactured items through the process flow based on the assigned priorities.

    摘要翻译： 一种用于确定生产流程优先级的方法包括在处理流程中处理多个制造的物品; 测量处理流程中的多个制成品的特性; 基于所测量的特性来估计所述多个制造物品的性能等级; 对具有相似估计性能等级的制成品进行分组; 将优先事项分配给具有类似估计绩效等级的制成品组; 以及基于所分配的优先级，通过所述处理流程来引导所述多个制造的物品。 制造系统包括多个处理工具，其适用于处理流程中的多个制造物品，计量工具和过程控制服务器。 计量工具适于测量处理流程中的多个制造物品的特性。 过程控制服务器适于基于测量的特性来估计多个制造物品的性能等级，将具有相似估计性能等级的制造物品分组，将具有相似估计性能等级的制造商品组的优先级分配给多个 基于分配的优先级，通过流程流程制造出的物品。

    Method and apparatus for control of multi-cup semiconductor manufacturing tracks
    5.
    发明授权
    Method and apparatus for control of multi-cup semiconductor manufacturing tracks 有权
    用于控制多杯半导体制造轨道的方法和装置

    公开(公告)号：US06549822B1

    公开(公告)日：2003-04-15

    申请号：US09625432

    申请日：2000-07-25

    申请人： Anthony J. Toprac

    发明人： Anthony J. Toprac

    IPC分类号： G06F1900

    CPC分类号： H01L21/67276

    摘要： The present invention provides for a method and an apparatus for controlling multiple semiconductor wafer cups. At least one process run of semiconductor devices is processed. A multi-wafer-cup process analysis is performed upon the processed semiconductor devices. At least one control parameter is modified for a subsequent process run of semiconductor devices using results from the multi-wafer-cup process analysis.

    摘要翻译： 本发明提供一种用于控制多个半导体晶片杯的方法和装置。 处理半导体器件的至少一个工艺流程。 对处理的半导体器件进行多晶圆杯处理分析。 使用多晶圆杯过程分析的结果，修改至少一个控制参数用于半导体器件的后续处理运行。

    Method for controlling deposition parameters based on polysilicon grain size feedback
    6.
    发明授权
    Method for controlling deposition parameters based on polysilicon grain size feedback 失效
    基于多晶硅粒度反馈控制沉积参数的方法

    公开(公告)号：US06511898B1

    公开(公告)日：2003-01-28

    申请号：US09577769

    申请日：2000-05-24

    申请人： Thomas Sonderman ,  Jeremy Lansford ,  Anthony J. Toprac

    发明人： Thomas Sonderman ,  Jeremy Lansford ,  Anthony J. Toprac

    IPC分类号： H01L2120

    CPC分类号： H01L22/26 ,  H01L22/14

    摘要： A processing line includes a deposition tool, a metrology tool and a controller. The deposition tool is adapted to form a polysilicon layer on a wafer in accordance with a recipe. The metrology tool is adapted to measure a grain size of the polysilicon layer. The controller is adapted to modify the recipe for subsequently formed polysilicon layers based on the measured grain size. A method for controlling a deposition process includes forming a polysilicon layer on a wafer in accordance with a recipe; measuring a grain size of the polysilicon layer; and changing the recipe for subsequently formed polysilicon layers based on the measured grain size.

    摘要翻译： 处理线包括沉积工具，计量工具和控制器。 沉积工具适于根据配方在晶片上形成多晶硅层。 测量工具适于测量多晶硅层的晶粒尺寸。 控制器适于基于测量的晶粒尺寸修改随后形成的多晶硅层的配方。 控制沉积工艺的方法包括根据配方在晶片上形成多晶硅层; 测量多晶硅层的晶粒尺寸; 并根据测得的晶粒尺寸改变随后形成的多晶硅层的配方。

    Method and apparatus for modeling thickness profiles and controlling subsequent etch process
    8.
    发明授权
    Method and apparatus for modeling thickness profiles and controlling subsequent etch process 有权
    用于建模厚度剖面和控制后续蚀刻工艺的方法和装置

    公开(公告)号：US06410351B1

    公开(公告)日：2002-06-25

    申请号：US09615481

    申请日：2000-07-13

    申请人： Christopher A. Bode ,  Anthony J. Toprac

    发明人： Christopher A. Bode ,  Anthony J. Toprac

    IPC分类号： H01L214763

    CPC分类号： H01L22/20

    摘要： A processing line includes a deposition tool, a metrology tool, an etch tool, and a process controller. The deposition tool is adapted to form a process layer on a plurality of wafers. The metrology tool is adapted to measure the thickness of the process layer for a sample of the wafers. The etch tool is adapted to etch the process layer in accordance with an operating recipe. The process controller is adapted to store a thickness profile model of the deposition tool, generate predicted process layer thicknesses for the wafers not measured by the metrology tool based on the process layer thickness measurements of the wafers in the sample and the thickness profile model, and modify the operating recipe of the etch tool based on the predicted process layer thicknesses. A method for controlling wafer uniformity includes storing a thickness profile model of a deposition tool; depositing a process layer on a plurality of wafers in the deposition tool; measuring the thickness of the process layer for a sample of the wafers; generating predicted process layer thicknesses for the wafers not measured based on the process layer thickness measurements and the thickness profile model; and etching the process layer in an etching tool in accordance with an operating recipe, the operating recipe being based on the predicted process layer thicknesses.

    摘要翻译： 处理线包括沉积工具，计量工具，蚀刻工具和过程控制器。 沉积工具适于在多个晶片上形成工艺层。 测量工具适于测量晶片样品的工艺层的厚度。 蚀刻工具适于根据操作配方蚀刻工艺层。 过程控制器适于存储沉积工具的厚度剖面模型，基于样品中的晶片的过程层厚度测量和厚度剖面模型，生成未被测量工具测量的晶片的预测处理层厚度，以及 基于预测的处理层厚度修改蚀刻工具的操作配方。 一种用于控制晶片均匀性的方法包括：存储沉积工具的厚度剖面模型; 在所述沉积工具中的多个晶片上沉积工艺层; 测量晶片样品的工艺层的厚度; 根据工艺层厚度测量和厚度剖面模型，生成未测量晶片的预测工艺层厚度; 并且根据操作配方在蚀刻工具中蚀刻处理层，操作配方基于预测的处理层厚度。

    Process control with control signal derived from metrology of a repetitive critical dimension feature of a test structure on the work piece
    9.
    发明授权
    Process control with control signal derived from metrology of a repetitive critical dimension feature of a test structure on the work piece 有权
    具有控制信号的过程控制来源于工件上测试结构的重复关键维度特征的度量

    公开(公告)号：US06368879B1

    公开(公告)日：2002-04-09

    申请号：US09401090

    申请日：1999-09-22

    申请人： Anthony J. Toprac

    发明人： Anthony J. Toprac

    IPC分类号： H01L2100

    CPC分类号： G03F7/70625 ,  G05B19/41875 ,  G05B2219/37525 ,  G05B2219/37576 ,  G05B2219/45026 ,  H01L22/20 ,  Y02P90/22

    摘要： A method is provided for manufacturing, the method including processing a workpiece in a processing step, measuring a critical dimension of features formed on the workpiece using a test structure formed on the workpiece, the test structure including a plurality of the features, and forming an output signal corresponding to the critical dimension measurements. The method also includes feeding back a control signal based on the output signal to adjust the processing performed in the processing step if the output signal corresponding to the critical dimension measurements indicates a predetermined tolerance value has been exceeded.

    摘要翻译： 提供了一种用于制造的方法，该方法包括在加工步骤中处理工件，使用形成在工件上的测试结构来测量形成在工件上的特征的临界尺寸，测试结构包括多个特征，并形成 输出信号对应于临界尺寸测量。 该方法还包括基于输出信号反馈控制信号以调整在处理步骤中执行的处理，如果对应于临界尺寸测量值的输出信号已经超过了预定的公差值。

    Method and apparatus for automatic routing for reentrant process
    10.
    发明授权
    Method and apparatus for automatic routing for reentrant process 有权
    用于可重入进程的自动路由的方法和装置

    公开(公告)号：US06360133B1

    公开(公告)日：2002-03-19

    申请号：US09335405

    申请日：1999-06-17

    申请人： William Jarrett Campbell ,  Anthony J. Toprac ,  Christopher A. Bone

    发明人： William Jarrett Campbell ,  Anthony J. Toprac ,  Christopher A. Bone

    IPC分类号： G06F1900

    CPC分类号： G05B19/41865 ,  G05B2219/32265 ,  G05B2219/32324 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/20

    摘要： The present invention provides for a method and an apparatus for automatic routing of semiconductor devices within a manufacturing area. Performance of a plurality of manufacturing tools is tracked while processing semiconductor devices. At least one optimal combination of the manufacturing tools is determined based upon the tracked performance of the manufacturing tools. A queuing system is implemented to attain the optimal combination of the manufacturing tools. A dispatch system is deployed in response to the queuing system for routing the semiconductor devices within the manufacturing area.

    摘要翻译： 本发明提供一种用于在制造区域内自动路由半导体器件的方法和装置。 在处理半导体器件的同时跟踪多个制造工具的性能。 基于制造工具的跟踪性能来确定制造工具的至少一个最佳组合。 实施排队系统以实现制造工具的最佳组合。 响应于用于在制造区域内布线半导体器件的排队系统部署调度系统。