发明授权
US06387715B1 Integrated circuit defect detection via laser heat and IR thermography
失效
通过激光热和红外热像仪进行集成电路缺陷检测
- 专利标题： Integrated circuit defect detection via laser heat and IR thermography
- 专利标题（中）： 通过激光热和红外热像仪进行集成电路缺陷检测
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申请号： US09409975申请日： 1999-09-30
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公开(公告)号： US06387715B1公开(公告)日： 2002-05-14
- 发明人: Brennan V. Davis , Rama R. Goruganthu , Jeffrey D. Birdsley , Michael R. Bruce , Rosalinda M. Ring
- 申请人： Brennan V. Davis , Rama R. Goruganthu , Jeffrey D. Birdsley , Michael R. Bruce , Rosalinda M. Ring
- 主分类号： H01L2166
- IPC分类号： H01L2166
摘要：
Defect detection for post-manufacturing analysis of an integrated circuit die is enhanced via a method and system that use IR thermography to detect defects in circuitry within the die. According to an example embodiment of the present invention, substrate is removed from an integrated circuit die and a target region is exposed. A portion of the target region is heated with an infrared (IR) laser beam, and the die is imaged using IR thermography. The image is compared with a reference image, and damage to the integrated circuit is detected therefrom.
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