发明授权
- 专利标题: Led array, and led printer head
- 专利标题(中): LED阵列和led打印头
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申请号: US09084324申请日: 1998-05-27
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公开(公告)号: US06388696B1公开(公告)日: 2002-05-14
- 发明人: Masumi Taninaka , Mitsuhiko Ogihara , Hiroshi Hamano , Takatoku Shimizu
- 申请人: Masumi Taninaka , Mitsuhiko Ogihara , Hiroshi Hamano , Takatoku Shimizu
- 优先权: JP9-138061 19970528; JP9-138067 19970528; JP9-156715 19970613
- 主分类号: B41J245
- IPC分类号: B41J245
摘要:
According to the present invention, a plurality of p-type semiconductor layers 13 are formed in a single row and a first layer insulating film 12 having first opening portions 16a and an n-side opening portion 17 is formed on the layers in an n-type semiconductor block 11. On the first layer insulating film 12, p-side electrodes 14 to connect to the p-type semiconductor layers 13 at the first opening portions 16a and an n-side electrode 55 (an n-side contact electrode 55a and an n-side pad electrode 55b) to connect with the n-type semiconductor block 11 at the n-side opening portion 17 are formed. Furthermore, p-side common wirings 4 to connect with specific p-side electrodes 14 are formed via a second layer insulating film 18. The p-side electrodes 14 and the n-side electrode 55 are formed using the same conductive film material through a single film formation and patterning process. An Au alloy film, for instance, may be used to form the conductive film that is to constitute the p-side electrodes 14 and the n-side electrode 55.