发明授权
- 专利标题： Low thermal expansion circuit board and multilayer wiring circuit board
- 专利标题（中）： 低热膨胀电路板和多层布线电路板
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申请号： US09697301申请日： 2000-10-27
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公开(公告)号： US06420018B1公开(公告)日： 2002-07-16
- 发明人: Yasushi Inoue , Masakazu Sugimoto , Amane Mochizuki
- 申请人： Yasushi Inoue , Masakazu Sugimoto , Amane Mochizuki
- 优先权： JP9-288798 19971021
- 主分类号： B32B300
- IPC分类号： B32B300
摘要：
A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe—based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.
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