公开(公告)号：US06420018B1

公开(公告)日：2002-07-16

申请号：US09697301

申请日：2000-10-27

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

IPC分类号： B32B300

CPC分类号： H05K1/056 ,  H01L23/142 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00

摘要： A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe—based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

摘要翻译： 可以容易且高可靠性地安装半导体元件的低热膨胀电路板1，其包括具有Ni-Fe基合金箔或钛箔作为芯的绝缘层3，两者上的布线导体4 侧面，以及在要安装半导体元件的一侧上的粘合树脂层5。

公开(公告)号：US06180261B2

公开(公告)日：2001-01-30

申请号：US09166419

申请日：1998-10-05

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

IPC分类号： B32B1508

CPC分类号： H05K1/056 ,  H01L23/142 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00

摘要： A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe-based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

摘要翻译： 可以容易且高可靠性地安装半导体元件的低热膨胀电路板1，其包括具有Ni-Fe基合金箔或钛箔作为芯的绝缘层3，两者上的布线导体4 侧面，以及在要安装半导体元件的一侧上的粘合树脂层5。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US5431863A

公开(公告)日：1995-07-11

申请号：US101817

申请日：1993-08-04

申请人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

发明人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36 ,  B29C65/48 ,  B26F1/31

CPC分类号： H01L21/4803 ,  H01L23/49572 ,  H01L24/24 ,  H01L24/82 ,  H05K3/361 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2201/09063 ,  H05K2201/10977 ,  H05K3/305

摘要： A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

摘要翻译： 一种安装半导体器件的方法，所述半导体器件包括具有绝缘膜的膜载体，所述膜载体的一侧具有连接引线和与所述膜载体连接的外部基板上的半导体元件，所述半导体器件包括在所述外部基板上形成用于粘合剂强制或粘合剂注入的开口 在其接合区域内的绝缘膜与外基板上的接合部分和接合区域附近的区域接触，将连接引线连接到外基板上的接合部分，并且通过形成的开口迫使或注入粘合剂 在绝缘膜中进入薄膜载体和外基板之间的空间。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5188702A

公开(公告)日：1993-02-23

申请号：US872504

申请日：1992-04-23

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

申请人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

发明人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

摘要： A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US09022562B2

公开(公告)日：2015-05-05

申请号：US13565551

申请日：2012-08-02

申请人： Brett T. Harding ,  Sheng Li ,  Amane Mochizuki ,  Eugene Dantsker

发明人： Brett T. Harding ,  Sheng Li ,  Amane Mochizuki ,  Eugene Dantsker

IPC分类号： C08K5/29 ,  F21V9/16 ,  G02C7/10 ,  G06F3/041 ,  G09G3/30 ,  C09B57/00 ,  C09B69/10 ,  C09B3/20 ,  G02B1/04

CPC分类号： C09K11/06 ,  A61F2/16 ,  A61F2002/1699 ,  C08K5/29 ,  C08K5/315 ,  C08K2201/001 ,  C09B3/20 ,  C09B57/00 ,  C09B57/008 ,  C09B69/102 ,  C09B69/103 ,  C09B69/109 ,  C09K11/025 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1014 ,  C09K2211/1044 ,  C09K2211/1055 ,  F21V9/30 ,  G02B1/04 ,  G02B1/041 ,  G02B1/043 ,  G02C7/04 ,  G02C7/049 ,  G02C7/104 ,  G06F3/041 ,  G09G3/30 ,  Y10T428/1041 ,  C08L101/12

摘要： Described herein are devices, compositions, and methods for improving color discernment.

公开(公告)号：US08721922B2

公开(公告)日：2014-05-13

申请号：US13123895

申请日：2009-10-13

申请人： Amane Mochizuki ,  Takashi Kondo ,  Sheng Li ,  Jesse Dan Froehlich ,  Hyunsik Chae

发明人： Amane Mochizuki ,  Takashi Kondo ,  Sheng Li ,  Jesse Dan Froehlich ,  Hyunsik Chae

IPC分类号： C09K11/06 ,  C07F19/00 ,  H01L51/54

CPC分类号： C09K11/06 ,  C09K2211/185 ,  H01L51/0085 ,  H01L51/0094 ,  H01L51/5016 ,  H05B33/14

摘要： Disclosed herein are compositions comprising an electron transport compound, an emissive compound, and an organic solvent. The emissive compound comprises an organic indium complex attached to a nanoparticle core. These compositions are useful in fabricating light emitting devices and can be deposited on a substrate via a printing process.

摘要翻译： 本文公开了包含电子传输化合物，发光化合物和有机溶剂的组合物。 发射化合物包括连接到纳米颗粒芯上的有机铟络合物。 这些组合物可用于制造发光器件，并且可以通过印刷工艺沉积在基底上。

公开(公告)号：US20130103123A1

公开(公告)日：2013-04-25

申请号：US13649277

申请日：2012-10-11

申请人： Sazzadur Rahman Khan ,  Sheng Li ,  Amane Mochizuki ,  Xingjia Wu ,  Juanita Josephine Anders

发明人： Sazzadur Rahman Khan ,  Sheng Li ,  Amane Mochizuki ,  Xingjia Wu ,  Juanita Josephine Anders

IPC分类号： A61N5/06

CPC分类号： A61N5/0616 ,  A61N5/062 ,  A61N5/0624 ,  A61N2005/0627 ,  A61N2005/063 ,  A61N2005/0645 ,  A61N2005/0653 ,  A61N2005/0662

摘要： Methods and devices related to wound healing using phototherapy are described. Some embodiments provide an organic light-emitting diode device, such as a light-emitting device for phototherapy, comprising Ring System 1, Ring System 2, Ring System 3, Ring System 4 or Ring System 5.

摘要翻译： 描述了使用光疗法伤口愈合相关的方法和装置。 一些实施例提供了一种有机发光二极管装置，例如用于光疗的发光装置，包括环系统1，环系统2，环系统3，环系统4或环系统5。