公开(公告)号：US06420018B1

公开(公告)日：2002-07-16

申请号：US09697301

申请日：2000-10-27

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

IPC分类号： B32B300

CPC分类号： H05K1/056 ,  H01L23/142 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00

摘要： A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe—based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

摘要翻译： 可以容易且高可靠性地安装半导体元件的低热膨胀电路板1，其包括具有Ni-Fe基合金箔或钛箔作为芯的绝缘层3，两者上的布线导体4 侧面，以及在要安装半导体元件的一侧上的粘合树脂层5。

公开(公告)号：US06180261B2

公开(公告)日：2001-01-30

申请号：US09166419

申请日：1998-10-05

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Amane Mochizuki

IPC分类号： B32B1508

CPC分类号： H05K1/056 ,  H01L23/142 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00

摘要： A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe-based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

摘要翻译： 可以容易且高可靠性地安装半导体元件的低热膨胀电路板1，其包括具有Ni-Fe基合金箔或钛箔作为芯的绝缘层3，两者上的布线导体4 侧面，以及在要安装半导体元件的一侧上的粘合树脂层5。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5188702A

公开(公告)日：1993-02-23

申请号：US872504

申请日：1992-04-23

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

申请人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

发明人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

摘要： A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US5431863A

公开(公告)日：1995-07-11

申请号：US101817

申请日：1993-08-04

申请人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

发明人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36 ,  B29C65/48 ,  B26F1/31

CPC分类号： H01L21/4803 ,  H01L23/49572 ,  H01L24/24 ,  H01L24/82 ,  H05K3/361 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2201/09063 ,  H05K2201/10977 ,  H05K3/305

摘要： A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

摘要翻译： 一种安装半导体器件的方法，所述半导体器件包括具有绝缘膜的膜载体，所述膜载体的一侧具有连接引线和与所述膜载体连接的外部基板上的半导体元件，所述半导体器件包括在所述外部基板上形成用于粘合剂强制或粘合剂注入的开口 在其接合区域内的绝缘膜与外基板上的接合部分和接合区域附近的区域接触，将连接引线连接到外基板上的接合部分，并且通过形成的开口迫使或注入粘合剂 在绝缘膜中进入薄膜载体和外基板之间的空间。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US06373000B1

公开(公告)日：2002-04-16

申请号：US09735893

申请日：2000-12-14

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

IPC分类号： H01R2372

摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

公开(公告)号：US6159586A

公开(公告)日：2000-12-12

申请号：US151520

申请日：1998-09-11

申请人： Yasushi Inoue ,  Masakazu Sugimoto

发明人： Yasushi Inoue ,  Masakazu Sugimoto

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/28 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/462 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/068 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/24917 ,  H01L2924/00

摘要： The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.

摘要翻译： 本发明涉及一种用于安装半导体芯片等的多层布线基板。多层布线基板由多个双面电路基板构成，每个双面电路基板由有机高分子量绝缘层和布线导体构成。 粘合剂用于层压双面电路基板。 在有机高分子量绝缘层内嵌有Ni-Fe系合金箔或钛箔。

公开(公告)号：US06462282B1

公开(公告)日：2002-10-08

申请号：US09338659

申请日：1999-06-23

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Kei Nakamura

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Kei Nakamura

IPC分类号： H05K116

CPC分类号： H05K1/0271 ,  H01L23/3164 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10674 ,  H01L2924/00

摘要： A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.

摘要翻译： 用于以倒装芯片的形式安装裸芯片的电路板。 用于保护与绝缘的状态的电路的金属箔布置在裸芯片所在的区域中。