发明授权
US06420093B1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
失效
增韧的苯并环丁烯聚合物及其在建立印刷电路板中的应用
- 专利标题： Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
- 专利标题（中）： 增韧的苯并环丁烯聚合物及其在建立印刷电路板中的应用
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申请号： US09496495申请日： 2000-02-02
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公开(公告)号： US06420093B1公开(公告)日： 2002-07-16
- 发明人: Kaoru Ohba , Brian Martin , Hideki Akimoto , Albert Charles Marie Achen , Philip E. Garrou , Britton Lee Kaliszewski , Ying-Hung So
- 申请人： Kaoru Ohba , Brian Martin , Hideki Akimoto , Albert Charles Marie Achen , Philip E. Garrou , Britton Lee Kaliszewski , Ying-Hung So
- 主分类号： G03F700
- IPC分类号： G03F700
摘要：
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
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