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1.发明授权Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards 失效增韧的苯并环丁烯聚合物及其在建立印刷电路板中的应用公开(公告)号：US06420093B1
公开(公告)日：2002-07-16
申请号：US09496495
申请日：2000-02-02
申请人： Kaoru Ohba , Brian Martin , Hideki Akimoto , Albert Charles Marie Achen , Philip E. Garrou , Britton Lee Kaliszewski , Ying-Hung So
发明人： Kaoru Ohba , Brian Martin , Hideki Akimoto , Albert Charles Marie Achen , Philip E. Garrou , Britton Lee Kaliszewski , Ying-Hung So
IPC分类号： G03F700
CPC分类号： H05K3/4655 , C08G61/02 , H05K3/4652 , H05K2201/0158 , H05K2201/0358
摘要： The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
摘要翻译： 本发明是使用镀有苯乙烯类韧性介电聚合物的金属箔来构建印刷线路板的方法。 本发明还是包含苯并环丁烯类单体或低聚物，烯属不饱和聚合物添加剂和任选的光活性化合物的增韧介电聚合物。
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2.发明授权公开(公告)号：US06670101B2
公开(公告)日：2003-12-30
申请号：US10043839
申请日：2002-01-10
IPC分类号： G03C500
CPC分类号： H05K3/4655 , C08G61/02 , H05K3/4652 , H05K2201/0158 , H05K2201/0358
摘要： The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
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