公开(公告)号：US06420093B1

公开(公告)日：2002-07-16

申请号：US09496495

申请日：2000-02-02

申请人： Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

发明人： Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

IPC分类号： G03F700

CPC分类号： H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

摘要： The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

摘要翻译： 本发明是使用镀有苯乙烯类韧性介电聚合物的金属箔来构建印刷线路板的方法。 本发明还是包含苯并环丁烯类单体或低聚物，烯属不饱和聚合物添加剂和任选的光活性化合物的增韧介电聚合物。

公开(公告)号：US06670101B2

公开(公告)日：2003-12-30

申请号：US10043839

申请日：2002-01-10

申请人： Kaoru Ohba ,  Hideki Akimoto ,  Philip E. Garrou ,  Ying-Hung So ,  Britton Lee Kaliszewski

发明人： Kaoru Ohba ,  Hideki Akimoto ,  Philip E. Garrou ,  Ying-Hung So ,  Britton Lee Kaliszewski

IPC分类号： G03C500

CPC分类号： H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

摘要： The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

公开(公告)号：US5223558A

公开(公告)日：1993-06-29

申请号：US914649

申请日：1992-07-15

申请人： Kaoru Ohba

发明人： Kaoru Ohba

IPC分类号： C08G59/12 ,  C08G59/42 ,  C09D163/00

CPC分类号： C08G59/4215 ,  C08G59/12 ,  C09D163/00

摘要： A process for preparing an epoxy dimer acid ester resin, which comprises reacting (a) an epoxy resin which is a glycidyl ether of a dihydric phenol having a weight average molecular weight of 1,000 to 30,000 and an epoxy equivalent of 300 to 5,000 with (b) a dimer acid in the presence of an organic solvent having an alcoholic hydroxyl group at a concentration such that the solid content of both reactants (a) and (b) ranges from 60 to 90 percent by weight based on the total weight of the reaction mixture. An epoxy dimer acid ester resin prepared by the process and a coating therefrom are also disclosed. The coating is particularly useful for coating a coil of a steel sheet.

摘要翻译： 一种制备环氧二聚酸酯树脂的方法，其包括使（a）环氧树脂，其是重均分子量为1,000至30,000的二元酚的缩水甘油醚和300至5000的环氧当量的环氧树脂与（b ）二聚酸在具有醇羟基的有机溶剂的存在下，其浓度使得两种反应物（a）和（b）的固体含量基于反应的总重量为60-90重量％ 混合物。 还公开了通过该方法制备的环氧二聚酸酯树脂和其涂层。 该涂层对于涂覆钢板的线圈特别有用。

公开(公告)号：US5070174A

公开(公告)日：1991-12-03

申请号：US635797

申请日：1990-12-31

申请人： Kaoru Ohba

发明人： Kaoru Ohba

IPC分类号： C09D163/00 ,  C08G59/14 ,  C08G81/00

CPC分类号： C08G81/00

摘要： Disclosed in a polyamide epoxy ester resin having a weight average molecular weight of 1,000 to 100,000, an epoxy equivalent of 500 to 10,000, and an acid value of not greater than 10, which is prepared by reacting(i) at least one epoxy resin which is a glycidyl ether of a dihydric phenol,(ii) at least one dihydric phenol and(iii) a polyamide dicarboxylic acid having an amine value of not greater than 20 and an acid value of at least 20, which is prepared by reacting a polymerized fatty acid composed mainly of a dimer acid with a diamine at a polymerized fatty acid/diamine molar ratio of from 2/1.0 to 2/1.9,at a ratio of such that the amount of the polyamide dicarboxylic acid segment in the resin ranges 1 to 30 percent by weight based on the weight of the resin.Also, disclosed are a process for preparing the polyamide epoxy ester resin and a coating composition comprising the resin. The coating composition is particularly useful for can coating.