- 专利标题: Heat exchanger for an electronic heat pump
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申请号: US09857668申请日: 2001-07-31
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公开(公告)号: US06446442B1公开(公告)日: 2002-09-10
- 发明人: Andrew W. Batchelor , Ben Banney , David McDonald , Tilak T. Chandratilleke
- 申请人: Andrew W. Batchelor , Ben Banney , David McDonald , Tilak T. Chandratilleke
- 优先权: AUPO3321 19991007
- 主分类号: F25B2102
- IPC分类号: F25B2102
摘要:
A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.