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公开(公告)号:US06619044B2
公开(公告)日:2003-09-16
申请号:US10206731
申请日:2002-07-26
IPC分类号: F25B2102
CPC分类号: F28F3/02 , F28F1/045 , F28F3/12 , F28F2260/02
摘要: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
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公开(公告)号:US06446442B1
公开(公告)日:2002-09-10
申请号:US09857668
申请日:2001-07-31
IPC分类号: F25B2102
CPC分类号: F25B21/02 , F25B25/00 , F25B2500/01
摘要: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
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