发明授权
- 专利标题： Semiconductor chip removing and conveying method and device
- 专利标题（中）： 半导体芯片去除和输送方法及装置
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申请号： US09746066申请日： 2000-12-26
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公开(公告)号： US06461942B2公开(公告)日： 2002-10-08
- 发明人: Mitsuhisa Watanabe , Kazuo Teshirogi , Eiji Yoshida , Yuzo Shimobeppu , Yoshito Konno , Kyouhei Tamaki
- 申请人： Mitsuhisa Watanabe , Kazuo Teshirogi , Eiji Yoshida , Yuzo Shimobeppu , Yoshito Konno , Kyouhei Tamaki
- 优先权： JP2000-163651 20000531
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.