Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device
    1.
    发明授权
    Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device 有权
    半导体元件的分选和获取方法,半导体器件的制造方法以及半导体器件

    公开(公告)号:US08445906B2

    公开(公告)日:2013-05-21

    申请号:US12690198

    申请日:2010-01-20

    IPC分类号: H01L23/58

    摘要: A method for sorting and acquiring a semiconductor element, including: disposing a plurality of semiconductor elements in an effective section in a semiconductor substrate; disposing a standard semiconductor element outside of the effective section in the semiconductor substrate; forming a bump in each of the plurality of the semiconductor elements and in the standard semiconductor element; performing a test on the plurality of the semiconductor elements in the effective section; forming a location map using the standard semiconductor element as a base point; and picking up the semiconductor elements determined as non-defective in the test from the plurality of the semiconductor elements based on the location map.

    摘要翻译: 一种用于分类和获取半导体元件的方法,包括:在半导体衬底中的有效部分中设置多个半导体元件; 在所述半导体衬底中的有效部分外部设置标准半导体元件; 在所述多个所述半导体元件和所述标准半导体元件中的每一个中形成凸块; 对有效部分中的多个半导体元件进行测试; 使用标准半导体元件形成位置图作为基点; 以及基于所述位置图从所述多个半导体元件中拾取在所述测试中被确定为无缺陷的半导体元件。

    METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT
    2.
    发明申请
    METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT 有权
    电子元件剥离方法及装置

    公开(公告)号:US20120312482A1

    公开(公告)日:2012-12-13

    申请号:US13588506

    申请日:2012-08-17

    IPC分类号: B32B38/10

    摘要: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

    摘要翻译: 剥离电子部件的方法。 该方法包括以下步骤:当电子部件粘附到带部件的第一主表面上时,使波纹管与作为带部件的另一个主表面的第二主表面接触; 并且在使波纹管与第二主面接触之后,通过向波纹管供给流体使波纹管和带部件变形,从而将电子部件从带部件剥离。

    METHOD FOR SORTING AND ACQUIRING SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    4.
    发明申请
    METHOD FOR SORTING AND ACQUIRING SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 有权
    用于分配和获取半导体元件的方法,用于生产半导体器件的方法和半导体器件

    公开(公告)号:US20100117084A1

    公开(公告)日:2010-05-13

    申请号:US12690198

    申请日:2010-01-20

    IPC分类号: H01L23/58 H01L21/66

    摘要: A method for sorting and acquiring a semiconductor element, including: disposing a plurality of semiconductor elements in an effective section in a semiconductor substrate; disposing a standard semiconductor element outside of the effective section in the semiconductor substrate; forming a bump in each of the plurality of the semiconductor elements and in the standard semiconductor element; performing a test on the plurality of the semiconductor elements in the effective section; forming a location map using the standard semiconductor element as a base point; and picking up the semiconductor elements determined as non-defective in the test from the plurality of the semiconductor elements based on the location map.

    摘要翻译: 一种用于分选和获取半导体元件的方法,包括:在半导体衬底中的有效部分中设置多个半导体元件; 在所述半导体衬底中的有效部分外部设置标准半导体元件; 在所述多个所述半导体元件和所述标准半导体元件中的每一个中形成凸块; 对有效部分中的多个半导体元件进行测试; 使用标准半导体元件形成位置图作为基点; 以及基于所述位置图从所述多个半导体元件中拾取在所述测试中被确定为无缺陷的半导体元件。

    Probe card and method of testing wafer having a plurality of semiconductor devices
    5.
    发明授权
    Probe card and method of testing wafer having a plurality of semiconductor devices 有权
    探针卡和测试具有多个半导体器件的晶片的方法

    公开(公告)号:US06774650B2

    公开(公告)日:2004-08-10

    申请号:US10392925

    申请日:2003-03-21

    IPC分类号: G01R3102

    摘要: A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material. An electrode pitch of the contact electrodes is expanded by the first wiring.

    摘要翻译: 一种用于测试形成多个半导体芯片的晶片的探针卡,所述探针卡包括基板和多层基板。 探针卡还可以包括柔性基底。 在其中一个芯片上与电极相对设置的接触电极设置在柔性基板的上方或下方,或者可以设置在多层基板上的弹性材料上。 第一布线具有连接到接触电极的第一部分,从第一部分的电平延伸到较低电平的多层基板的电平转换部分,以及连接到电平转换部分的端部处的连接端子 多层基板上的内部端子。 多层基板中的第二布线将内部端子连接到多层基板的外围的外部端子。 电路板上的第三个接线将多层基板上的外部端子连接到电路板上的外部连接端子。 在晶片测试期间施加的温度负载导致的内部端子的位移由第一布线的电平转换部分补偿。 与探针卡上的接触电极和芯片上的电极之间的接触相关的不均匀性由接触电极和/或弹性材料补偿。 接触电极的电极间距由第一布线扩大。

    Method for fabricating semiconductor device
    8.
    发明授权
    Method for fabricating semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08349624B2

    公开(公告)日:2013-01-08

    申请号:US12908262

    申请日:2010-10-20

    申请人: Yoshito Konno

    发明人: Yoshito Konno

    IPC分类号: H01L21/82

    摘要: A method of manufacturing a semiconductor device, includes providing a mark above a main surface on a semiconductor substrate, separating the semiconductor substrate into a plurality of semiconductor elements by cutting the semiconductor substrate, determining a reference semiconductor element on the basis of a coordinate data indicating coordinates of the mark and coordinates of all of the semiconductor elements on the semiconductor substrate, and picking-out the semiconductor elements on the basis of the coordinate data using a pick-out apparatus. The providing operation includes forming a protective coat onto the main surface of the semiconductor substrate, irradiating a point on the main surface of the semiconductor substrate with a laser beam through the protective coat, and eliminating the protective coat from the main surface of the semiconductor substrate.

    摘要翻译: 一种制造半导体器件的方法,包括在半导体衬底上的主表面上提供标记,通过切割半导体衬底将半导体衬底分离成多个半导体元件,基于指示的坐标数据确定参考半导体元件 半导体衬底上的所有半导体元件的标记和坐标的坐标,以及使用拾取装置基于坐标数据来选出半导体元件。 提供操作包括在半导体衬底的主表面上形成保护涂层,用激光束照射半导体衬底的主表面上的点通过保护涂层,并且从半导体衬底的主表面消除保护涂层 。

    Small nonreciprocal circuit element that can be easily wired
    9.
    发明授权
    Small nonreciprocal circuit element that can be easily wired 失效
    小型不可逆电路元件,可以方便地布线

    公开(公告)号:US06930566B2

    公开(公告)日:2005-08-16

    申请号:US10337141

    申请日:2003-01-06

    IPC分类号: H01P1/383 H01P1/36 H01P1/387

    CPC分类号: H01P1/387

    摘要: A nonreciprocal circuit element of the present invention comprises a first yoke and a second yoke that form a magnetic closed circuit. A plurality of chip capacitors with a first electrode and a second electrode are installed in the box-shaped second yoke. Subsequently, a circuit substrate used for the nonreciprocal circuit element can be smaller than conventional circuit substrates, and the assembly of the nonreciprocal circuit element is excellent. Further, since the capacitances of the chip capacitors can be adjusted through windows of the second yoke, the electrical performance of the nonreciprocal circuit element is excellent.

    摘要翻译: 本发明的不可逆电路元件包括形成磁闭环的第一磁轭和第二磁轭。 具有第一电极和第二电极的多个片状电容器安装在盒形第二磁轭中。 随后,用于不可逆电路元件的电路基板可以比传统的电路基板更小,并且不可逆电路元件的组装是优异的。 此外,由于可以通过第二磁轭的窗口来调节片式电容器的电容,所以不可逆电路元件的电性能优异。

    METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110097828A1

    公开(公告)日:2011-04-28

    申请号:US12908262

    申请日:2010-10-20

    申请人: Yoshito KONNO

    发明人: Yoshito KONNO

    IPC分类号: H01L21/66

    摘要: A method of manufacturing a semiconductor device, includes providing a mark above a main surface on a semiconductor substrate, separating the semiconductor substrate into a plurality of semiconductor elements by cutting the semiconductor substrate, determining a reference semiconductor element on the basis of a coordinate data indicating coordinates of the mark and coordinates of all of the semiconductor elements on the semiconductor substrate, and picking-out the semiconductor elements on the basis of the coordinate data using a pick-out apparatus. The providing operation includes forming a protective coat onto the main surface of the semiconductor substrate, irradiating a point on the main surface of the semiconductor substrate with a laser beam through the protective coat, and eliminating the protective coat from the main surface of the semiconductor substrate.

    摘要翻译: 一种制造半导体器件的方法,包括在半导体衬底上的主表面上提供标记,通过切割半导体衬底将半导体衬底分离成多个半导体元件,基于指示的坐标数据确定参考半导体元件 半导体衬底上的所有半导体元件的标记和坐标的坐标,以及使用拾取装置基于坐标数据来选出半导体元件。 提供操作包括在半导体衬底的主表面上形成保护涂层,用激光束照射半导体衬底的主表面上的点通过保护涂层,并且从半导体衬底的主表面消除保护涂层 。