Invention Grant
- Patent Title: Method for making a circuit board
- Patent Title (中): 制作电路板的方法
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Application No.: US09812989Application Date: 2001-03-20
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Publication No.: US06467161B2Publication Date: 2002-10-22
- Inventor: Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
- Applicant: Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
- Main IPC: H05K320
- IPC: H05K320
Abstract:
A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
Public/Granted literature
- US20010040048A1 Circuit board and a method for making the same Public/Granted day:2001-11-15
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