摘要:
A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
摘要:
A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
摘要:
A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.
摘要:
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
摘要:
An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要:
A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.
摘要:
A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要:
A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
摘要:
A chemical etching manufacturing system is provided for removing material from a workpiece comprising a fluid control device, wherein the fluid control device controls at least one of fluid flow and fluid pressure, a fluid injection device, and a pulsed flow of chemical etchant adapted to pulsedly contact and remove material from a workpiece, wherein the pulse of the pulsed flow of chemical etchant is controlled by the fluid control device, and the pulsed flow of chemical etchant is emitted from the fluid injection device. A method of chemical etching in a manufacturing system is also provided comprising providing a workpiece, introducing the workpiece to a pulsed flow of chemical etchant, wherein the flow of chemical etchant pulsedly contacts and removes material from the workpiece, and removing the workpiece from the pulsed flow of chemical etchant.
摘要:
An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.