Structures for use in conjunction with surface micromachined structures are formed using a two-step etching process. In various exemplary embodiments, the two-step etching process comprises a modified Bosch etch. According to various exemplary embodiments of the two-step etch, first mask and second masks are used to prepare a layer for etching one or more desired structures. The first mask is used to define at least one large feature. The second mask is used to define at least one small feature (small as compared to the at least one large feature). The second mask is formed over the first mask which is formed over the layer. In the first etching step, the at least one small feature is etched into the layer. Then, the second mask is removed using the chemical rinsing agent. In the second etching step, the at least one large feature is etched into the layer such that the at least one small feature propagates further into the layer ahead of the at least one large feature. The first mask is then removed. Other surface micromachined methods and structures are provided as well.