Semiconductor chip, chip-on-chip structure device and assembling method thereof

发明授权

US06476499B1 Semiconductor chip, chip-on-chip structure device and assembling method thereof 有权

标题翻译：半导体芯片，片上芯片结构器件及其组装方法

请登陆查看更多内容

专利标题： Semiconductor chip, chip-on-chip structure device and assembling method thereof
专利标题（中）： 半导体芯片，片上芯片结构器件及其组装方法
申请号： US09499579

申请日： 2000-02-07
公开(公告)号： US06476499B1

公开(公告)日： 2002-11-05
发明人: Junichi Hikita , Koji Yamamoto , Isamu Nishimura , Nobuhisa Kumamoto
申请人： Junichi Hikita , Koji Yamamoto , Isamu Nishimura , Nobuhisa Kumamoto
优先权： JP11-030478 19990208; JP11-030479 19990208; JP11-030480 19990208; JP11-038794 19990217; JP11-047078 19990224
主分类号： H01L2352
IPC分类号： H01L2352

Semiconductor chip, chip-on-chip structure device and assembling method thereof

摘要：

A semiconductor chip (3) to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks (35) provided on a back face (34) thereof. The electrode marks (35) are respectively provided in association with a plurality of electrodes (33) provided on the front face (31) of the semiconductor chip in the same arrangement as the arrangement of the electrodes (33). The arrangement of the electrode marks (35) represents the arrangement of the electrodes (33) on the front face (31) when viewed from the side of the back face (34) of the semiconductor chip 3. Therefore, the semiconductor chip (3) can easily be positioned with the front face downward on the basis of the electrode marks (35).

摘要（中）：

为了形成片上芯片结构，其前表面向下定位的半导体芯片（3）具有设置在其背面（34）上的电极标记（35）。电极标记（35）与设置在半导体芯片的正面（31）上的多个电极（33）分别设置成与电极（33）的布置相同的布置。电极标记（35）的布置表示从半导体芯片3的背面（34）的侧面观察时的正面（31）上的电极（33）的配置。因此，半导体芯片（3））可以根据电极标记（35）容易地将前表面向下定位。

信息查询

Espacenet