发明授权
US06486072B1 System and method to facilitate removal of defects from a substrate
失效
有助于从基底去除缺陷的系统和方法
- 专利标题： System and method to facilitate removal of defects from a substrate
- 专利标题（中）： 有助于从基底去除缺陷的系统和方法
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申请号： US09709974申请日： 2000-11-10
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公开(公告)号： US06486072B1公开(公告)日： 2002-11-26
- 发明人: Khoi A. Phan , Bharath Rangarajan , Bhanwar Singh
- 申请人： Khoi A. Phan , Bharath Rangarajan , Bhanwar Singh
- 主分类号： H01L21302
- IPC分类号： H01L21302
摘要：
A system and method are disclosed for facilitating removal of a defect from a substrate. A charge is applied at the surface of substrate, such as in the form of an ionized gas, to weaken attractive forces between the defect and the substrate. As a result of weakening the attractive forces, a suitable defect removal system may be employed to remove the defect.
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