A chip mounting structure provides an adhesive conductor between a chip and a printed circuit board. The adhesive conductor includes an adhesive layer having viscoelasticity to cushion thermal shock caused due to a difference in the thermal expansive coefficients between mutually connected layers; and conductive wires for electrically connecting the layers by vertically penetrating the adhesive layer. The adhesive conductor in accordance with the present invention includes a plurality of conductive wires penetrating the adhesive layer having viscoelasticity in a half-hardened state, so that the chip and the printed circuit board can be physically attached and at the same time be electrically connected. Also, the flip chip structure is protected from the thermal shock caused due to the difference between the thermal expansive coefficients of the chip and the printed circuit board, so that products fabricated by adopting it can have a high reliability.