发明授权
- 专利标题： Semiconductor device with elastic structure and wiring
- 专利标题（中）： 具有弹性结构和布线的半导体器件
-
申请号： US09983177申请日： 2001-10-23
-
公开(公告)号： US06515371B2公开(公告)日： 2003-02-04
- 发明人: Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
- 申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
- 优先权： JP9-185621 19970711; JP9-230906 19970827
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.
公开/授权文献
- US20020047215A1 Semiconductor device and its manufacturing method 公开/授权日：2002-04-25