发明授权
- 专利标题： Method of encapsulating a circuit assembly
- 专利标题（中）： 密封电路组件的方法
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申请号： US09587336申请日： 2000-06-05
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公开(公告)号： US06531343B1公开(公告)日： 2003-03-11
- 发明人: Kenneth Raymond Carter , Craig Jon Hawker , James Lupton Hedrick , Robert Dennis Miller , Michael Anthony Gaynes , Stephen Leslie Buchwalter
- 申请人： Kenneth Raymond Carter , Craig Jon Hawker , James Lupton Hedrick , Robert Dennis Miller , Michael Anthony Gaynes , Stephen Leslie Buchwalter
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
A method of encapsulating a circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate by applying an encapsulant adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.