公开(公告)号：US08476773B2

公开(公告)日：2013-07-02

申请号：US12787485

申请日：2010-05-26

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/52

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US08242010B2

公开(公告)日：2012-08-14

申请号：US12787503

申请日：2010-05-26

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20100230475A1

公开(公告)日：2010-09-16

申请号：US12787527

申请日：2010-05-26

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： B23K31/02

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

公开(公告)号：US20100230474A1

公开(公告)日：2010-09-16

申请号：US12787503

申请日：2010-05-26

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： B23K31/02 ,  B23K1/20

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US06326237B1

公开(公告)日：2001-12-04

申请号：US09325988

申请日：1999-06-04

申请人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

发明人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

IPC分类号： H01L2148

CPC分类号： H01L23/295 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15174 ,  Y10T29/49144 ,  Y10T29/49146

摘要： The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A)nRB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof Also disclosed is a method of encapsulating a circuit assembly using the encapsulant of the invention.

摘要翻译： 本发明是一种包括芯片的封装电路组件; 底物; 至少一个焊点，其中所述焊点跨越所述芯片和所述衬底，在所述芯片和所述衬底之间形成导电连接; 以及邻近所述焊接接头形成的密封剂，其中所述密封剂包含通过下式的单体反应形成的超支化聚合物：（A）nRB，其中A是与B反应的偶联基团，B是与A反应的偶联基团 ，n大于1，R为选自芳族基团，脂族基团和其混合物的基团。还公开了一种使用本发明的密封剂封装电路组件的方法。

公开(公告)号：US06919420B2

公开(公告)日：2005-07-19

申请号：US10310749

申请日：2002-12-05

申请人： Stephen Leslie Buchwalter ,  Claudius Feger ,  Gareth Hougham ,  Nancy LaBianca ,  Hosadurga Shobha

发明人： Stephen Leslie Buchwalter ,  Claudius Feger ,  Gareth Hougham ,  Nancy LaBianca ,  Hosadurga Shobha

IPC分类号： C08G65/26 ,  H01L21/56 ,  H01L23/29 ,  C07D303/32 ,  C08G4/00 ,  C08K3/36 ,  C08L59/00 ,  C08L63/00

CPC分类号： C08G65/2654 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2224/0401

摘要： Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package.

摘要翻译： 可再结晶的热固性酸可分解的缩醛和缩酮基环氧低聚物可以B阶段分级成无粘性状态。 包含环氧低聚物的组合物用于可再加工组件，例如晶片级底部未充满微电子封装。

公开(公告)号：US06531343B1

公开(公告)日：2003-03-11

申请号：US09587336

申请日：2000-06-05

申请人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

发明人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2224/0401

摘要： A method of encapsulating a circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate by applying an encapsulant adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.

摘要翻译： 一种封装包括芯片的电路组件的方法; 底物; 在芯片和衬底之间跨越的至少一个焊点通过在焊料接头附近施加密封剂而形成芯片和衬底之间的导电连接，其中密封剂包括通过环状低聚物的开环聚合形成的热塑性聚合物。

公开(公告)号：US06369452B1

公开(公告)日：2002-04-09

申请号：US09361723

申请日：1999-07-27

申请人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

发明人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

IPC分类号： H01L2348

CPC分类号： H01L23/3142 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.

摘要翻译： 可与电子组件（例如芯片）结合的电子结构。 电子结构可以通过使用结构环氧树脂粘合剂连接到诸如芯片的电子组件。 电子结构包括金属板上的矿物层和矿物层上的粘附促进剂层。 金属板包括金属物质，其包括具有或不具有金属涂层的纯金属。 金属物质可以包括诸如不锈钢，铝，钛，铜，镀有镍的铜和涂有铬的铜等物质。 矿物层包括衍生自矿物的化合物; 例如来自石英的二氧化硅（SiO 2）。 这样的化合物可以包括二氧化硅，氮化硅和碳化硅等物质。 化合物可以以结晶或无定形形式存在。 粘合促进剂可以包括诸如硅烷，钛酸盐，锆酸盐和铝酸盐的化学物质。

公开(公告)号：US6111323A

公开(公告)日：2000-08-29

申请号：US754

申请日：1997-12-30

申请人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

发明人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701

摘要： The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.

摘要翻译： 本发明是一种包括芯片的封装电路组件; 底物; 至少一个跨接在所述芯片和所述基板之间的焊接接头，在所述芯片和所述基板之间形成导电连接; 以及邻近所述焊接接头形成的密封剂，其中所述密封剂包括通过环状低聚物的开环聚合形成的热塑性聚合物。

公开(公告)号：US5776370A

公开(公告)日：1998-07-07

申请号：US637993

申请日：1996-04-25

申请人： Ali Afzali-Ardakani ,  Stephen Leslie Buchwalter

发明人： Ali Afzali-Ardakani ,  Stephen Leslie Buchwalter

IPC分类号： C08L79/00 ,  C08G73/00 ,  H01B1/12 ,  H05K1/09 ,  H05K3/10 ,  H01B1/00 ,  C08J5/00 ,  C08K5/04 ,  H01B1/20

CPC分类号： H01B1/128 ,  H01B1/121 ,  H05K1/09 ,  H05K3/105

摘要： Disclosed are charge transfer complexes based on a polyaniline in combination with an organic electron electron acceptor. The resulting conductive polymer possesses enhanced electrical, thermal and solubility properties over known conductive polymers. Also disclosed is a charge transfer based composition of matter whose electrical conductivity, chemical and physical properties are further enhanced by doping with protonic acid. The composition is prepared by a simple method and has widespread application in the printed circuit field, and in various other devices.

摘要翻译： 公开了基于聚苯胺与有机电子电子受体组合的电荷转移络合物。 所得的导电聚合物相对于已知的导电聚合物具有增强的电，热和溶解性能。 还公开了基于电荷转移的物质组合物，其导电性，化学和物理性质通过掺杂质子酸进一步增强。 该组合物通过简单的方法制备，并且在印刷电路领域和各种其它装置中广泛应用。