发明授权
- 专利标题: Low inductance termination for electronic components
- 专利标题(中): 电子元件的低电感端接
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申请号: US10004554申请日: 2001-12-03
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公开(公告)号: US06545855B1公开(公告)日: 2003-04-08
- 发明人: Scott W. Repplinger , Jiri Slaby , Christopher J. Hoyle , Brian Lau
- 申请人: Scott W. Repplinger , Jiri Slaby , Christopher J. Hoyle , Brian Lau
- 主分类号: H01G220
- IPC分类号: H01G220
摘要:
An apparatus (100) for reducing inductance in a capacitor having a first terminal (12) and a spaced-apart second terminal (14), includes a first conductive plate (120) and a second conductive plate (140). The first conductive plate (120) is electrically coupled to the first terminal (12). The second conductive plate (140) is electrically coupled to the second terminal (14) and is disposed in parallel with the first conductive plate (120) so as to overlap at least a portion of the first conductive plate (120). An insulating member (122 and 142) is disposed between the first conductive plate (120) and the second conductive plate (140). The insulating member (122 and 142) insulates the first conductive plate (120) from the second conductive plate (140).
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