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公开(公告)号：US06545855B1
公开(公告)日：2003-04-08
申请号：US10004554
申请日：2001-12-03
IPC分类号： H01G220
CPC分类号： H01G2/065 , H01C1/01 , H01C1/14 , H05K1/0216 , H05K3/308 , H05K3/3426 , H05K2201/0792 , H05K2201/10015
摘要： An apparatus (100) for reducing inductance in a capacitor having a first terminal (12) and a spaced-apart second terminal (14), includes a first conductive plate (120) and a second conductive plate (140). The first conductive plate (120) is electrically coupled to the first terminal (12). The second conductive plate (140) is electrically coupled to the second terminal (14) and is disposed in parallel with the first conductive plate (120) so as to overlap at least a portion of the first conductive plate (120). An insulating member (122 and 142) is disposed between the first conductive plate (120) and the second conductive plate (140). The insulating member (122 and 142) insulates the first conductive plate (120) from the second conductive plate (140).
摘要翻译： 一种用于减小具有第一端子（12）和间隔开的第二端子（14）的电容器中的电感的装置（100），包括第一导电板（120）和第二导电板（140）。 第一导电板（120）电耦合到第一端子（12）。 第二导电板（140）电耦合到第二端子（14）并且与第一导电板（120）平行设置，以便与第一导电板（120）的至少一部分重叠。 绝缘构件（122和142）设置在第一导电板（120）和第二导电板（140）之间。 绝缘构件（122和142）将第一导电板（120）与第二导电板（140）绝缘。
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2.发明授权Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board 有权层叠电容器和去耦电容器的接线连接结构以及接线板公开(公告)号：US06678145B2
公开(公告)日：2004-01-13
申请号：US10106383
申请日：2002-03-27
申请人： Yasuyuki Naito , Masaaki Taniguchi , Yoichi Kuroda , Haruo Hori , Takanori Kondo
发明人： Yasuyuki Naito , Masaaki Taniguchi , Yoichi Kuroda , Haruo Hori , Takanori Kondo
IPC分类号： H01G220
CPC分类号： H01L23/66 , H01G4/30 , H01L23/49822 , H01L2224/05155 , H01L2224/05171 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/16235 , H01L2924/01068 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15313 , H01L2924/19106 , H01L2924/3011 , H05K1/0231 , H05K1/181 , H05K2201/10515 , H05K2201/10719 , H05K2201/10734 , H01L2924/00014
摘要： An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provided on a wiring board. The capacitor includes a plurality of first external terminal electrodes connected to first internal electrodes via a plurality of first feedthrough conductors and a plurality of second external terminal electrodes connected to second internal electrodes via a plurality of second feedthrough conductors. The first external terminal electrodes provided on a first major surface of a capacitor body are connected to via-hole conductors at the hot side for the power source within a substrate, and the second external terminal electrodes provided on first and second major surfaces are connected to grounding via-hole conductors and a mother board within the substrate.
摘要翻译： 提供一种用于封装具有低ESL值的层叠电容器的装置，并且用于去耦电容器以连接到用于提供MPU的MPU芯片的电源电路。 叠层电容器容纳在设置在布线板上的空腔内。 电容器包括多个通过多个第一馈通导体连接到第一内部电极的第一外部端子电极和经由多个第二馈通导体连接到第二内部电极的多个第二外部端子电极。 设置在电容器主体的第一主表面上的第一外部端子电极连接到基板内的电源的热侧的通孔导体，并且设置在第一和第二主表面上的第二外部端子电极连接到 接地通孔导体和基板内的母板。
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公开(公告)号：US06452780B2
公开(公告)日：2002-09-17
申请号：US09750006
申请日：2000-12-27
申请人： Shinichi Kobayashi , Shuji Watanabe , Yoshitaka Kageyama , Akira Nagai , Osamu Yamaoka , Mitsuru Nagashima , Yuko Ihara
发明人： Shinichi Kobayashi , Shuji Watanabe , Yoshitaka Kageyama , Akira Nagai , Osamu Yamaoka , Mitsuru Nagashima , Yuko Ihara
IPC分类号： H01G220
摘要： A capacitor including a ceramic body, a glass layer formed on each of opposite surfaces of the ceramic body, and a first metallic layer formed on the glass layer. Preferably, a lead terminal is connected to the first metallic layer or to a second metallic layer which is provided on the first metallic layer, by use of solder containing Pb in an amount of 2.5 wt. % or less. Preferably, a lead terminal which is plated with a substance containing Pb in an amount of 5 wt. % or less is soldered onto the first metallic layer or the second metallic layer.
摘要翻译： 一种电容器，包括陶瓷体，形成在所述陶瓷体的每个相对表面上的玻璃层和形成在所述玻璃层上的第一金属层。 优选地，引线端子通过使用含有2.5重量％的Pb的焊料连接到设置在第一金属层上的第一金属层或第二金属层。 ％ 或更少。 优选地，电镀有含有5重量％的Pb的物质的引线端子。 ％以下被焊接到第一金属层或第二金属层上。
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公开(公告)号：US06362948B1
公开(公告)日：2002-03-26
申请号：US09350065
申请日：1999-07-08
申请人： Nobushige Moriwaki , Kazuhiro Yoshida , Kenichi Watanabe , Akio Shobu , Osamu Yamaoka , Yukio Tanaka
发明人： Nobushige Moriwaki , Kazuhiro Yoshida , Kenichi Watanabe , Akio Shobu , Osamu Yamaoka , Yukio Tanaka
IPC分类号： H01G220
摘要： A first metallic terminal plate is joined to a first side-face of an electronic chip formed by lamination of lamination-capacitors as plural electronic elements, and a second terminal plate to the second side-face of the chip. The first and second metallic terminal plates comprises first terminal plate portions joined to the first and second side-faces, respectively, and the second terminal plate portions bent along the lower edges of the first terminal plate portions toward the opposed side-faces, respectively and elongated from the range under the electronic chip to be out of the range in the width direction.
摘要翻译： 第一金属端子板与通过叠层电容器形成的电子芯片的第一侧面接合，作为多个电子元件，以及第二端子板连接到芯片的第二侧面。 第一和第二金属端子板分别包括接合到第一和第二侧面的第一端子板部分，并且第二端子板部分分别沿着第一端子板部分的下边缘朝着相对的侧面弯曲，并且 从电子芯片下方的范围延伸出宽度方向的范围。
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5.发明授权公开(公告)号：US06310757B1
公开(公告)日：2001-10-30
申请号：US09621601
申请日：2000-07-21
申请人： Kiyoshi Tuzuki , Sachiko Kawamura
发明人： Kiyoshi Tuzuki , Sachiko Kawamura
IPC分类号： H01G220
CPC分类号： H01G4/232 , H01C1/142 , H01C7/18 , H01C17/288 , Y10T29/43
摘要： There are provided an electronic component having external electrodes and a method for manufacturing thereof for which treatment of the wastewater is not needed and has electrolytically plated layers which are substantially plated only on the conductive layers but not on the ceramic surfaces. In the method for manufacturing the electronic component, an activation treatment is performed in which palladium is deposited on a conductive layer on the electronic component, and then electrolytic Ni plating and electrolytic solder plating are performed sequentially.
摘要翻译： 提供了具有外部电极的电子部件及其制造方法，其中不需要处理废水，并且具有仅在导电层上而不是在陶瓷表面上基本镀覆的电解镀层。 在电子部件的制造方法中，进行钯电镀部件的导电层上的钯的活化处理，然后依次进行电镀Ni电镀和电解焊接电镀。
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公开(公告)号：US06201683B1
公开(公告)日：2001-03-13
申请号：US09301251
申请日：1999-04-28
申请人： Masayuki Yamada , Takuji Nakagawa
发明人： Masayuki Yamada , Takuji Nakagawa
IPC分类号： H01G220
CPC分类号： H01G2/065 , H01F2027/295 , H01G4/232 , H05K3/3426 , Y02P70/613
摘要： In a mounting structure for a ceramic electronic part in which a terminal member formed of a metal plate is connected to a terminal formed on a ceramic electronic component, thermal effects caused by a substrate are to be suppressed to prevent mechanical damage to the ceramic electronic component, such as cracking. For this purpose, a length of an intermediate portion between the ceramic electronic component and the substrate, measured along the length of the terminal member, is at least 5 mm.
摘要翻译： 在陶瓷电子部件的安装结构中，由金属板形成的端子部件与形成在陶瓷电子部件上的端子连接，抑制由基板引起的热效应，以防止对陶瓷电子部件的机械损伤 ，如开裂。 为此，沿着端子构件的长度测量的陶瓷电子部件和基板之间的中间部分的长度为至少5mm。
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公开(公告)号：US06483692B2
公开(公告)日：2002-11-19
申请号：US09741302
申请日：2000-12-19
IPC分类号： H01G220
CPC分类号： H01G2/065 , H01L2924/15311
摘要： A capacitor (FIGS. 6-9) includes one or more extended surface lands (604, 704, 804, 904, FIGS. 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, FIG. 6) of the capacitor or 20% of the length (914, FIG. 9) of the capacitor. When embedded within an integrated circuit package (1102, FIG. 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).
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8.发明授权Ceramic electronic component having electronic component containing cuprous oxide 失效具有含有氧化亚铜的电子部件的陶瓷电子部件公开(公告)号：US06381118B1
公开(公告)日：2002-04-30
申请号：US09618273
申请日：2000-07-18
申请人： Hideki Yokoyama , Takaya Ishigaki , Akira Sasaki , Shintarou Kon , Tetuji Maruno
发明人： Hideki Yokoyama , Takaya Ishigaki , Akira Sasaki , Shintarou Kon , Tetuji Maruno
IPC分类号： H01G220
CPC分类号： H01G4/232 , H01C1/148 , H01C7/18 , H01C17/283 , H01L41/0472 , H01L41/293 , Y10T29/43 , Y10T29/435 , Y10T29/4902 , Y10T29/49147
摘要： A ceramic electronic component comprising external electrodes having first electrode layers containing at least a noble metal, cuprous oxide, and glass ingredient electrically connected to internal electrodes having a noble metal. As the ceramic electronic components, for example, a multi-layer ceramic capacitor, multi-layer varistor, multi-layer dielectric resonator, multi-layer piezoelectric element, etc. may be mentioned.
摘要翻译： 一种陶瓷电子部件，包括外部电极，所述外部电极具有至少含有贵金属，氧化亚铜和玻璃成分的电极层，所述第一电极层与具有贵金属的内部电极电连接。 作为陶瓷电子部件，例如可以举出多层陶瓷电容器，多层变阻器，多层介质谐振器，层叠型压电元件等。
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公开(公告)号：US06185086B2
公开(公告)日：2001-02-06
申请号：US09203766
申请日：1998-12-02
IPC分类号： H01G220
摘要： A capacitor element having a terminal, an electric insulating material installed to cover the capacitor element, a wire connected to the terminal, and a reinforcing structure installed at the junction for connecting the terminal and the wire. In this constitution, the junction of the terminals and wires maintains mechanical strength and electrical insulation and is enhanced in reliability for a long period against mechanical stress or vibration to the capacitor from outside. Still more, invasion of moisture or dust into the capacitor can be prevented. As a result, the life of the excellent mechanical strength and electrical insulation is enhanced, and the capacitor having a stable reliability for a long time may be obtained.
摘要翻译： 具有端子的电容器元件，安装用于覆盖电容器元件的电绝缘材料，连接到端子的电线以及安装在用于连接端子和电线的连接处的加强结构。 在这种结构中，端子和电线的接合部保持机械强度和电绝缘性，并且长时间地提高了机械应力或从外部向电容器的振动的可靠性。 此外，可以防止水分或灰尘侵入电容器。 结果，提高了优异的机械强度和电绝缘性的寿命，并且可以获得长时间具有稳定的可靠性的电容器。
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