Invention Grant
- Patent Title: Printed wiring board and method of manufacturing the same
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Application No.: US09891819Application Date: 2001-06-26
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Publication No.: US06555208B2Publication Date: 2003-04-29
- Inventor: Masaru Takada , Hiroyuki Kobayashi , Kenji Chihara , Hisashi Minoura , Kiyotaka Tsukada , Mitsuhiro Kondo
- Applicant: Masaru Takada , Hiroyuki Kobayashi , Kenji Chihara , Hisashi Minoura , Kiyotaka Tsukada , Mitsuhiro Kondo
- Priority: JP9-14635 19970110; JP9-52481 19970219; JP9-62131 19970228; JP9-65509 19970303; JP9-361961 19971209
- Main IPC: B32B300
- IPC: B32B300

Abstract:
A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.
Public/Granted literature
- US20010038905A1 Printed wiring board and method of manufacturing the same Public/Granted day:2001-11-08
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