发明授权
- 专利标题： Alignment method, alignment apparatus, profiler, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory
- 专利标题（中）： 对准方法，对准装置，轮廓仪，曝光装置，曝光装置维护方法，半导体装置制造方法和半导体制造工厂
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申请号： US09866604申请日： 2001-05-30
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公开(公告)号： US06559924B2公开(公告)日： 2003-05-06
- 发明人: Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
- 申请人： Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
- 优先权： JP2000/164352 20000601
- 主分类号： G03B2742
- IPC分类号： G03B2742
摘要：
An alignment method includes the steps of (i) in order to expose a pattern of a first object onto a second object, measuring positions of a plurality of marks on the second object with a mark detection device and aligning the first and second objects with each other, and (ii) measuring shapes of the plurality of marks on the second object, thereby obtaining offsets that should be reflected in the measured values of the mark detection device. The shapes of the plurality of the marks are measured with a shape measurement device with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement device with a possibility of coming into contact with the mark.
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