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    Management system and apparatus method therefor, and device manufacturing method
    3.
    发明申请
    Management system and apparatus method therefor, and device manufacturing method 有权
    管理系统及其装置方法及装置制造方法

    公开(公告)号：US20050137837A1

    公开(公告)日：2005-06-23

    申请号：US10901106

    申请日：2004-07-29

    申请人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    发明人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    IPC分类号： G03F9/00 ,  G03F7/20 ,  G05B19/418 ,  H01L21/027 ,  G06F17/50

    CPC分类号： G03F7/70633 ,  G03F7/705 ,  G03F7/70525 ,  G03F9/7092 ,  G05B2219/32018 ,  Y02P90/22

    摘要： A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.

    摘要翻译： 管理工业设备的参数的管理装置获取通过操作工作装置具有操作作业参数值和非操作作业参数值而获得的AGA测量结果。 检查装置获取通过检查操作工作中的工业装置的操作结果而获得的“检查结果”。 根据AGA测量结果和检查结果估计参数值变化时检查结果的变化。 将待处理对象（例如，晶片）之间的参数值和检查结果中的变化（3sigma）的检查结果的灵敏度（斜率）两者或至少一个最小化（极端）的变量设置为 最优参数。

    Alignment method, alignment apparatus, profiler, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory
    5.
    发明授权
    Alignment method, alignment apparatus, profiler, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory 有权
    对准方法，对准装置，轮廓仪，曝光装置，曝光装置维护方法，半导体装置制造方法和半导体制造工厂

    公开(公告)号：US06559924B2

    公开(公告)日：2003-05-06

    申请号：US09866604

    申请日：2001-05-30

    申请人： Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto

    发明人： Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto

    IPC分类号： G03B2742

    CPC分类号： G03F9/7061 ,  B82Y10/00 ,  G03F9/7076 ,  G03F9/7092

    摘要： An alignment method includes the steps of (i) in order to expose a pattern of a first object onto a second object, measuring positions of a plurality of marks on the second object with a mark detection device and aligning the first and second objects with each other, and (ii) measuring shapes of the plurality of marks on the second object, thereby obtaining offsets that should be reflected in the measured values of the mark detection device. The shapes of the plurality of the marks are measured with a shape measurement device with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement device with a possibility of coming into contact with the mark.

    摘要翻译： 对准方法包括以下步骤：（i）为了将第一物体的图案曝光到第二物体上，用标记检测装置测量第二物体上的多个标记的位置，并将第一和第二物体与每个 和（ii）测量第二物体上的多个标记的形状，从而获得应反映在标记检测装置的测量值中的偏移。 使用形状测量装置测量多个标记的形状，通过参照具有与标记接触的形状测量装置的校准，可以不用与标记接触的形状测量装置。

    SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS
    6.
    发明申请
    SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS 失效
    表面形状测量装置和曝光装置

    公开(公告)号：US20090286172A1

    公开(公告)日：2009-11-19

    申请号：US12465567

    申请日：2009-05-13

    申请人： Koichi Sentoku ,  Takahiro Matsumoto ,  Satoru Oishi ,  Hideki Ina

    发明人： Koichi Sentoku ,  Takahiro Matsumoto ,  Satoru Oishi ,  Hideki Ina

    IPC分类号： G03F7/20 ,  G01B11/24 ,  G03B27/54

    CPC分类号： G03B27/54 ,  G01B11/24 ,  G01J3/45 ,  G01J2003/1213 ,  G01J2003/1226 ,  G03F9/7003 ,  G03F9/7015 ,  G03F9/7026 ,  G03F9/7088

    摘要： A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths.

    摘要翻译： 表面形状测量装置被配置为测量待测物体的表面形状，并且包括：分束器，被配置为将来自光源的白光分成两束光束;一对棱镜，每个棱镜被配置为增加入射角 已经被分束器分离并被引导到物体或参考表面的每个光束，每个棱镜具有在白色光的波长或更小的周期形成并具有蛾眼形状的抗反射部分， 叠加单元，被配置为用来自所述参考表面的参考光叠加来自所述物体的物体光并且已经通过所述第二棱镜，并且产生白色干涉光;以及Lyot滤波器，其被配置为离散地分离所述白色干涉光， 波长。

    Management system, management apparatus, management method, and device manufacturing method
    7.
    发明授权
    Management system, management apparatus, management method, and device manufacturing method 失效
    管理体系，管理手段，管理方法和装置制造方法

    公开(公告)号：US07069104B2

    公开(公告)日：2006-06-27

    申请号：US10423888

    申请日：2003-04-28

    申请人： Takehiko Suzuki ,  Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto ,  Satoru Oishi

    发明人： Takehiko Suzuki ,  Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto ,  Satoru Oishi

    IPC分类号： G06F9/455

    CPC分类号： G05B19/41875 ,  G05B2219/32182 ,  G05B2219/32191 ,  Y02P90/22

    摘要： A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.

    摘要翻译： 一种管理系统，包括：获取装置，用于获取通过操作具有设定参数值和另一参数值的工业设备获得的实际处理结果;以及估计处理结果;检查装置，用于检查用设定参数值获得的处理结果;以及 获取和累积检查结果值，根据由获取装置获取的处理结果和由检查装置获得的检查结果值来改变设定参数值的改变装置，用于评估检测结果值的变化状态的评估装置 基于由检查装置积存的检查结果值的处理结果，以及判定装置，其根据评价装置的评价结果​​，决定执行获取装置的频率。

    Management system and apparatus, method therefor, and device manufacturing method
    9.
    发明授权
    Management system and apparatus, method therefor, and device manufacturing method 有权
    管理系统及装置，方法及装置制造方法

    公开(公告)号：US06785583B2

    公开(公告)日：2004-08-31

    申请号：US10423893

    申请日：2003-04-28

    申请人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    发明人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    IPC分类号： G06F1900

    CPC分类号： G03F7/70633 ,  G03F7/705 ,  G03F7/70525 ,  G03F9/7092 ,  G05B2219/32018 ,  Y02P90/22

    摘要： A semiconductor device manufacturing apparatus management system includes a semiconductor device manufacturing apparatus which operates in accordance with a parameter, an obtaining device for obtaining evaluation values of an operation result of the semiconductor device manufacturing apparatus corresponding to a plurality of parameter values of the parameter, a holding device for holding the evaluation values obtained by the obtaining device for each object to be processed by the semiconductor device manufacturing apparatus, and an optimization device for analyzing the evaluation values held by the holding device. The optimization device optimizes the parameter on the basis of at least one of a sensitivity representing a change degree of the evaluation values upon the change in the parameter, and a variation amount of the evaluation values for each object to be processed.

    摘要翻译： 半导体器件制造装置管理系统包括根据参数操作的半导体器件制造装置，获得装置，用于获得与参数的多个参数值相对应的半导体器件制造装置的操作结果的评估值， 保持装置，用于保持由半导体装置制造装置中的每个待处理对象获得装置获得的评估值;以及优化装置，用于分析由保持装置保持的评估值。 优化装置基于表示参数的变化时的评价值的变化程度的灵敏度和对待处理对象的评价值的变化量中的至少一个来优化参数。

    Management system and apparatus, method therefor, and device manufacturing method
    10.
    发明授权
    Management system and apparatus, method therefor, and device manufacturing method 有权
    管理系统及装置，方法及装置制造方法

    公开(公告)号：US07373213B2

    公开(公告)日：2008-05-13

    申请号：US10901106

    申请日：2004-07-29

    申请人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    发明人： Satoru Oishi ,  Hideki Ina ,  Takehiko Suzuki ,  Koichi Sentoku ,  Takahiro Matsumoto

    IPC分类号： G06F19/00

    CPC分类号： G03F7/70633 ,  G03F7/705 ,  G03F7/70525 ,  G03F9/7092 ,  G05B2219/32018 ,  Y02P90/22

    摘要： A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.

    摘要翻译： 管理工业设备的参数的管理装置获取通过操作工作装置具有操作作业参数值和非操作作业参数值而获得的AGA测量结果。 检查装置获取通过检查操作工作中的工业装置的操作结果而获得的“检查结果”。 根据AGA测量结果和检查结果估计参数值变化时检查结果的变化。 将待处理对象（例如，晶片）之间的参数值和检查结果中的变化（3sigma）的检查结果的灵敏度（斜率）两者或至少一个最小化（极端）的变量设置为 最优参数。