发明授权
US06582829B1 Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
有权
包含均相乙烯互聚物和嵌段共聚物的热熔粘合剂组合物
- 专利标题： Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
- 专利标题（中）： 包含均相乙烯互聚物和嵌段共聚物的热熔粘合剂组合物
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申请号： US09345684申请日： 1999-06-30
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公开(公告)号： US06582829B1公开(公告)日： 2003-06-24
- 发明人: Thomas H. Quinn , Janelle C. Cameron , Beth M. Eichler-Johnson , Michael S. Keehr , Jeffrey S. Lindquist , David B. Malcolm , Kevin W. McKay , Deepak R. Parikh
- 申请人： Thomas H. Quinn , Janelle C. Cameron , Beth M. Eichler-Johnson , Michael S. Keehr , Jeffrey S. Lindquist , David B. Malcolm , Kevin W. McKay , Deepak R. Parikh
- 主分类号： B32B2308
- IPC分类号： B32B2308
摘要：
A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.