- 专利标题： Solder paste and electronic device
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申请号： US09993615申请日： 2001-11-27
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公开(公告)号： US06596094B2公开(公告)日： 2003-07-22
- 发明人: Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
- 申请人： Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
- 优先权： JP2000-361873 20001128; JP2001-256218 20010827
- 主分类号： B23K35363
- IPC分类号： B23K35363
摘要：
A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.
公开/授权文献
- US20020102432A1 Solder paste and electronic device 公开/授权日：2002-08-01