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公开(公告)号：US06596094B2
公开(公告)日：2003-07-22
申请号：US09993615
申请日：2001-11-27
申请人： Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
发明人： Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
IPC分类号： B23K35363
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/0218 , H05K2201/10689 , H05K2203/0545 , Y10T428/12063 , Y10T428/12882
摘要： A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.
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公开(公告)号：US06428911B2
公开(公告)日：2002-08-06
申请号：US09930245
申请日：2001-08-16
IPC分类号： B23K120
CPC分类号： B23K35/262 , B23K1/002 , B23K1/20 , H05K3/282 , H05K3/3463 , Y10T428/12903
摘要： The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.
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公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译： 具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。 由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。 由上述焊料合金构成的电气或电子设备的焊接结合体。
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公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译： 无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。 本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。 本发明的焊接键由本发明的焊料合金中的任一种组成。
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公开(公告)号：US07425765B2
公开(公告)日：2008-09-16
申请号：US11084204
申请日：2005-03-21
IPC分类号： H01L23/532
CPC分类号： H01L21/76898 , H01L21/76877 , H01L2924/0002 , H05K1/0306 , H05K3/3463 , H05K3/4038 , H01L2924/00
摘要： A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.
摘要翻译： 耐氧化性优异的高熔点焊料合金，特别是具有高抗氧化性和高熔点的焊料合金，适用于填充直径为几十微米，高纵横比的精细通孔，形成通孔填充材料， 其包含含有0.001重量％至1重量％的铝的锌 - 铝焊料合金，余量为锌和不可避免的杂质。
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公开(公告)号：US20060125105A1
公开(公告)日：2006-06-15
申请号：US11084204
申请日：2005-03-21
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L21/76877 , H01L2924/0002 , H05K1/0306 , H05K3/3463 , H05K3/4038 , H01L2924/00
摘要： A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.
摘要翻译： 耐氧化性优异的高熔点焊料合金，特别是具有高抗氧化性和高熔点的焊料合金，适用于填充直径为几十微米，高纵横比的精细通孔，形成通孔填充材料， 其包含含有0.001重量％至1重量％的铝的锌 - 铝焊料合金，余量为锌和不可避免的杂质。
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