发明授权
- 专利标题： Polishing method
- 专利标题（中）： 抛光方法
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申请号： US09618999申请日： 2000-07-18
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公开(公告)号： US06596638B1公开(公告)日： 2003-07-22
- 发明人: Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
- 申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
- 优先权： JP9-299937 19971031
- 主分类号： H01L21302
- IPC分类号： H01L21302
摘要：
A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items, such as slurries and polishing pads, is reduced. A metal film formed on an insulating film having a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.