Invention Grant
- Patent Title: Method for fabricating a CMOS image sensor
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Application No.: US09893140Application Date: 2001-06-26
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Publication No.: US06607951B2Publication Date: 2003-08-19
- Inventor: Chong-Yao Chen , Chen-Bin Lin , Feng-Ming Liu
- Applicant: Chong-Yao Chen , Chen-Bin Lin , Feng-Ming Liu
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
A fabrication method for a CMOS image sensory device is described. An isolation layer is formed in the substrate to isolate a photodiode sensory region and a transistor device region. A gate structure is further formed on the transistor device region, followed by forming concurrently a source/drain region in the transistor device region beside the side of the gate structure and a doped region in the photodiode sensory region. Thereafter, a self-aligned block is formed on the photodiode sensory region, followed by forming a protective layer on the substrate.
Public/Granted literature
- US20020197758A1 Method for fabricating a CMOS image sensor Public/Granted day:2002-12-26
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