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US06624512B2 Semiconductor integrated circuit device and printed wired board for mounting the same 失效
半导体集成电路器件和印刷线路板用于安装它们

  • Patent Title: Semiconductor integrated circuit device and printed wired board for mounting the same
  • Patent Title (中): 半导体集成电路器件和印刷线路板用于安装它们
  • Application No.: US10157981
    Application Date: 2002-05-31
  • Publication No.: US06624512B2
    Publication Date: 2003-09-23
  • Inventor: Hitoshi Kurusu
  • Applicant: Hitoshi Kurusu
  • Priority: JP2001-384255 20011218
  • Main IPC: H01L2348
  • IPC: H01L2348
Semiconductor integrated circuit device and printed wired board for mounting the same
Abstract:
A semiconductor integrated circuit device and a printed wired board which self-align to each other in an exact and precise manner. The semiconductor integrated circuit device has conductive bumps. The printed wired board has conductive recessed members at positions corresponding to the conductive bumps. Each of the conductive bumps is fitted into the corresponding conductive recessed member so that the printed wired board is aligned with the semiconductor integrated circuit device.
Abstract(Chinese):

半导体集成电路器件和印刷线路板，其精确和精确地彼此自对准。 半导体集成电路器件具有导电凸块。 印刷布线板在与导电凸块相对应的位置处具有导电凹槽。 每个导电凸块装配到相应的导电凹进部件中，使得印刷的布线板与半导体集成电路器件对准。

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