发明授权
US06627390B2 Masking frame plating method for forming masking frame plated layer
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用于形成掩蔽框架镀层的掩模框架电镀方法
- 专利标题: Masking frame plating method for forming masking frame plated layer
- 专利标题(中): 用于形成掩蔽框架镀层的掩模框架电镀方法
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申请号: US09893225申请日: 2001-06-28
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公开(公告)号: US06627390B2公开(公告)日: 2003-09-30
- 发明人: Xue Hua Wu , Yi-Chun Liu , Yining Hu , Jei-Wei Chang , Kochan Ju
- 申请人: Xue Hua Wu , Yi-Chun Liu , Yining Hu , Jei-Wei Chang , Kochan Ju
- 主分类号: G03C500
- IPC分类号: G03C500
摘要:
A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.
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