发明授权
- 专利标题: Positive sensitive resin composition and a process for forming a resist pattern therewith
- 专利标题(中): 正敏树脂组合物及其形成抗蚀剂图案的方法
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申请号: US09418368申请日: 1999-10-14
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公开(公告)号: US06630285B2公开(公告)日: 2003-10-07
- 发明人: Genji Imai , Ritsuko Fukuda , Toshiro Takao , Keiichi Ikeda , Yoshihiro Yamamoto
- 申请人: Genji Imai , Ritsuko Fukuda , Toshiro Takao , Keiichi Ikeda , Yoshihiro Yamamoto
- 优先权: JP10-294281 19981015; JP11-187328 19990701; JP11-187329 19990701; JP11-187330 19990701
- 主分类号: G03F7039
- IPC分类号: G03F7039
摘要:
A pattern can be precisely formed by irradiating, with an active energy beam, a positive sensitive resin composition according to this invention comprising a base polymer, an ether-bond-containing olefinic unsaturated compound and an acid-generating agent, where the base polymer is a copolymer comprising the structural units represented by formulas (1) to (3): where R1 and R3 are each independently hydrogen or methyl and R2 is C1-C6 straight or branched unsubstituted alkyl or C1-C6 straight or branched substituted alkyl, wherein a, b and c are 0.05 to 0.7, 0.15 to 0.8 and 0.01 to 0.5, respectively and a+b+c=1.
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