A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the plane of the connection pins. The thickness of this ridge essentially corresponds to the thickness of the connection pins. On the side surface area located opposite the side surface area from which the connection pins protrude, in the plane of the connection pins, the ridge passes or transitions into a groove such that there is no ridge protruding outwardly beyond the side surface in this area. Thus, the component can be better placed by a tool such as a suction needle onto a printed circuit board without interference from such a ridge. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as a docking surface for a suction needle.