公开(公告)号：US5350943A

公开(公告)日：1994-09-27

申请号：US35168

申请日：1993-03-22

Applicant: Jorg Angerstein ,  Siegfried Giebler ,  Thomas Mistele ,  Werner Schairer ,  Helmut Scheidle

Inventor： Jorg Angerstein ,  Siegfried Giebler ,  Thomas Mistele ,  Werner Schairer ,  Helmut Scheidle

IPC: H01L23/50 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/552 ,  H05K9/00 ,  H01L25/04 ,  H01L23/34

CPC classification number: H01L23/49575 ,  H01L23/49551 ,  H01L23/552 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A semiconductor assembly with a metal frame configuration is described, having a semiconductor component (HL) on a carrier section (T) of a ground strip section (M). The ground strip segment has an extension section (V) with which it is extended beyond said carrier section and is both folded over in relation to said carrier section and of sufficient length that it covers said semiconductor component in order to shield it electromagnetically.In this assembly, the ground strip section has a multiple function. It is used not only for carrying and contacting of electrical components, but also acts at the same time as electromagnetic shielding for a semiconductor component, for example for the radiation detector of a remote control reception module. This shielding is dependably connected to ground since it is formed as one piece with the ground line, it is simple to manufacture since no special connecting operations are necessary, and it is space-saving since no space is required for stable connection points between the shielding and other parts of the assembly.

Abstract translation: 描述了具有金属框架结构的半导体组件，其具有在接地条部分（M）的载体部分（T）上的半导体部件（HL）。 接地条段具有延伸部分（V），其延伸超过所述载体部分，并且相对于所述载体部分折叠并且覆盖所述半导体部件的足够的长度以便以电磁屏蔽。 在这个组装中，接地条部分具有多重功能。 不仅用于携带和接触电气部件，而且还用于例如用于遥控接收模块的辐射检测器的半导体部件的电磁屏蔽的同时。 该屏蔽层由于与地线形成为一体，因此可靠地接地，由于不需要特殊的连接操作，因此制造简单，节省空间，因为屏蔽层之间的稳定连接点不需要空间 和组装的其他部分。

公开(公告)号：US06653564B2

公开(公告)日：2003-11-25

申请号：US09991348

申请日：2001-11-20

Applicant: Helmut Scheidle

Inventor： Helmut Scheidle

IPC: H01L2328

CPC classification number: H01L23/49838 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding material is arranged such that there are still frame sections of the conductor strip outside the housing. An enlarged frame section of the conductor strip is widened so as to extend into contact with, e.g. directly adjacent to or even protruding into the housing, in order to prevent the formation of a molding flash ridge on this housing surface. The enlarged frame section is finally removed. The avoidance of a molding flash ridge allows the component to be suction-held by a suction needle at this housing surface.

Abstract translation: 至少一个半导体元件位于导电导体条上。 在导体条和至少一个半导体元件周围，由模制材料制成的壳体被布置成使得导体条的外框仍然在外壳外部。 导体带的扩大的框架部分被加宽，以便延伸与例如接触的导体条接触。 直接邻近或甚至突出到壳体中，以防止在该壳体表面上形成模制闪光脊。 放大的框架部分最终被移除。 避免成型闪光条允许部件在该壳体表面被抽吸针吸住。

公开(公告)号：US06635955B2

公开(公告)日：2003-10-21

申请号：US09991346

申请日：2001-11-20

Applicant: Helmut Scheidle

Inventor： Helmut Scheidle

IPC: H01L2302

CPC classification number: H05K3/303 ,  H01L23/3107 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1815 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the plane of the connection pins. The thickness of this ridge essentially corresponds to the thickness of the connection pins. On the side surface area located opposite the side surface area from which the connection pins protrude, in the plane of the connection pins, the ridge passes or transitions into a groove such that there is no ridge protruding outwardly beyond the side surface in this area. Thus, the component can be better placed by a tool such as a suction needle onto a printed circuit board without interference from such a ridge. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as a docking surface for a suction needle.

Abstract translation: 模制电子部件具有从基本上为长方体的壳体的侧表面区域在单个平面上突出的多个连接销，并且模制的壳体材料的周向脊从连接销的平面上的另一侧面区域突出。 该脊的厚度基本上对应于连接销的厚度。 在与连接销突出的侧表面区域相对的侧表面区域中，在连接销的平面中，脊通过或转变成凹槽，使得在该区域中没有向外突出超出侧表面的脊。 因此，可以通过诸如吸针的工具将组件更好地放置在印刷电路板上而不受这种脊的干扰。 本发明特别适用于生产分离面穿过作为吸引针的对接表面的壳体表面的模塑电子部件。