Invention Grant
US06642134B2 Semiconductor processing employing a semiconductor spacer 有权
采用半导体衬垫的半导体处理

  • Patent Title: Semiconductor processing employing a semiconductor spacer
  • Patent Title (中): 采用半导体衬垫的半导体处理
  • Application No.: US09401797
    Application Date: 1999-09-22
  • Publication No.: US06642134B2
    Publication Date: 2003-11-04
  • Inventor: Emi IshidaScott Luning
  • Applicant: Emi IshidaScott Luning
  • Main IPC: H01L213205
  • IPC: H01L213205
Semiconductor processing employing a semiconductor spacer
Abstract:
A semiconductor device is provided with semiconducting sidewall spacers used in the formation of source/drain regions. The semiconducting sidewall spacers also reduce the possibility of suicide shorting through shallow source/drain junctions. Embodiments include doping the semiconducting sidewall spacers so that they serve as a source of impurities for forming source/drain extensions during activation annealing.
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