Invention Grant
- Patent Title: Semiconductor processing employing a semiconductor spacer
- Patent Title (中): 采用半导体衬垫的半导体处理
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Application No.: US09401797Application Date: 1999-09-22
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Publication No.: US06642134B2Publication Date: 2003-11-04
- Inventor: Emi Ishida , Scott Luning
- Applicant: Emi Ishida , Scott Luning
- Main IPC: H01L213205
- IPC: H01L213205

Abstract:
A semiconductor device is provided with semiconducting sidewall spacers used in the formation of source/drain regions. The semiconducting sidewall spacers also reduce the possibility of suicide shorting through shallow source/drain junctions. Embodiments include doping the semiconducting sidewall spacers so that they serve as a source of impurities for forming source/drain extensions during activation annealing.
Public/Granted literature
- US20030170969A1 SEMICONDUCTOR PROCESSING EMPLOYING A SEMICONDUCTING SPACER Public/Granted day:2003-09-11
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